Tensile tests of micro anchors anodically bonded between Pyrex glass and aluminum thin film coated on silicon wafer

Microelectronics Reliability

Volumn 48, Issue 10, 2008, Pages 1720-1723

  Hu, Yu Qun ^a   Zhao, Ya Pu ^a   Yu, Tongxi ^b  

^a INSTITUTE OF MECHANICS   (China)

^b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ALUMINUM; CHEMICAL SENSORS; ELECTROMECHANICAL DEVICES; GLASS; OPTICAL FILMS; SILICON; SILICON ALLOYS; TENSILE TESTING; THICK FILMS; THIN FILM DEVICES; THIN FILMS; WAVEGUIDES;

ALUMINUM THIN FILMS; ANODIC BONDING; INTERMEDIATE LAYERS;

SEMICONDUCTING SILICON COMPOUNDS;

EID: 50949087052     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.04.016     Document Type: Article

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