Wafer bonding techniques for microsystem packaging

Journal of Physics: Conference Series

Volumn 34, Issue 1, 2006, Pages 943-948

  Wei, J ^a  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33744530264     PISSN: 17426588     EISSN: 17426596     Source Type: Conference Proceeding    
DOI: 10.1088/1742-6596/34/1/156     Document Type: Article

References (13)

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