SCOPUS 정보 검색 플랫폼

Sensors and Actuators, A: Physical

Volumn 151, Issue 1, 2009, Pages 77-80

Anodic bonding of glasses with interlayers for fully transparent device applications

(1) Mrozek, Piotr a

a BIALYSTOK UNIVERSITY OF TECHNOLOGY (Poland)

Author keywords

Anodic bonding; Field assisted sealing; Multilayer structure; Thin film

Indexed keywords

APPLICATIONS; COMPOSITE FILMS; ELECTRIC RESISTANCE; FILM PREPARATION; GLASS; MULTILAYERS; SEMICONDUCTING FILMS; THIN FILM DEVICES; TITANIUM; VACUUM; VACUUM DEPOSITION;

ANODIC BONDING; BONDING TEMPERATURES; BONDING TIME; CONDUCTIVE INTERLAYERS; DEVICE APPLICATIONS; ELECTRICAL RESISTIVITIES; FIELD ASSISTED SEALING; GLASS PLATES; HIGHER DEGREES; MULTILAYER STRUCTURE; OPTICAL TRANSMITTANCES; OPTIMAL CONDITIONS; PRE-HEATING TIME; THERMAL PROCESSING; THIN-FILM DEPOSITIONS; TI FILMS; TI THIN FILMS; TITANIUM THIN FILMS;

GLASS BONDING;

EID: 63049096799 PISSN: 09244247 EISSN: None Source Type: Journal
DOI: 10.1016/j.sna.2009.01.018 Document Type: Article

Times cited : (16)

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