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Volumn 38, Issue 9, 2009, Pages 1979-1989
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Silicon nitride films deposited by RF sputtering for microstructure fabrication in MEMS
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Author keywords
MEMS; RF sputtering; Silicon nitride; Structural material; Surface micromachining
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Indexed keywords
ARGON AMBIENT;
BULK MICROMACHINING TECHNOLOGY;
ETCH RATES;
FILM DEPOSITION;
LOCAL OXIDATION OF SILICONS;
LOW TEMPERATURES;
MICROCANTILEVER BEAMS;
MICROELECTROMECHANICAL SYSTEMS;
MICROSTRUCTURE FABRICATION;
OTHER APPLICATIONS;
PHOSPHOSILICATE GLASS;
QUARTZ SUBSTRATE;
RADIO-FREQUENCY SPUTTERING;
RF DIODE SPUTTERING;
RF SPUTTERING;
RF-POWER;
SACRIFICIAL LAYER;
SILICON NITRIDE FILM;
SPUTTERING PRESSURES;
STRUCTURAL MATERIAL;
STRUCTURAL MATERIALS;
ARGON;
BUILDING MATERIALS;
COMPOSITE MICROMECHANICS;
MEMS;
MICROCRYSTALLINE SILICON;
MICROELECTROMECHANICAL DEVICES;
OXIDE MINERALS;
PHOTORESISTS;
QUARTZ;
SEMICONDUCTING SILICON COMPOUNDS;
SILICON NITRIDE;
SILICON OXIDES;
SURFACE MICROMACHINING;
SURFACE ROUGHNESS;
SURFACES;
SILICON WAFERS;
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EID: 68949155533
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-009-0846-8 Document Type: Article |
Times cited : (26)
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References (29)
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