Anodic bonding characteristics of MLCA/Si-wafer using a sputtered Pyrex #7740 glass layer for MEMS applications

Sensors and Actuators, A: Physical

Volumn 116, Issue 2, 2004, Pages 352-356

  Chung, Gwiy Sang ^a   Kim, Jae Min ^a  

^a Dongseo University   (South Korea)

Author keywords

Anodic bonding; MEMS; MLCA; Piezoelectric; Pyrex 7740 glass

Indexed keywords

ACTUATORS; ANNEALING; ANODIC OXIDATION; CERAMIC MATERIALS; DEPOSITION; GLASS; INTERFACES (MATERIALS); MAGNETRONS; MICROELECTROMECHANICAL DEVICES; PIEZOELECTRIC DEVICES; THIN FILMS;

ANODIC BONDING; MEMS; MLCA; PIEZOELECTRIC;

SILICON WAFERS;

EID: 4544261833     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2004.04.029     Document Type: Article

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