Structure and mechanical properties of electrodeposited nanocrystalline Ni-Fe alloys

Journal of the Electrochemical Society

Volumn 160, Issue 11, 2013, Pages

  Vicenzo, Antonello ^a  

^a POLITECNICO DI MILANO   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84894742034     PISSN: 00134651     EISSN: 19457111     Source Type: Journal    
DOI: 10.1149/2.109311jes     Document Type: Article

References (86)

1. P. C. Andricacos and N. Robertson, IBM J. Res. Develop., 42, 671 (1998).
2. R. L. Comstock, J. Mater. Sci.: Mater. Electron., 13, 509 (2002).
3. J. Y. Park and M. G. Allen, J. Micromech. Microeng., 8, 307 (1998).
4. H. Lehr, W. Ehrfeld, M. Schmidt, E. Kallenbach, and H. A. Tuan, J. Micromech. Microeng., 2(4), 229 (1992).
5. J. Hruby, MRS Bull., 26, 337 (2001).
6. J. J. Kelly and N. Y. C. Yang, Microsyst. Technol., 11, 331 (2005).
7. M. Baghbanan, U. Erb, and G. Palumbo, Phys. Stat. Sol. (a), 203, 1259 (2006).
8. X. Zheng, X. Chen, F. Gu, Y. Liu, and D.-W. Lee, J. Vac. Sci. Technol., B, 28, 1097 (2010).
9. M. R. J. Gibbs, E. W. Hill, and P. J. Wright, J. Phys. D: Appl. Phys., 37, R237 (2004).
10. N. V. Myung, D.-Y. Park, B.-Y. Yoob, and P. T. A. Sumodjo, J. Magn. Magn. Mater., 265(2), 189 (2003).
11. G. Zangari, Modern Electroplating, 5th ed., M. Schlesinger and M. Paunovic, Editors, p. 617, John Wiley & Sons, New York (2010).
12. T. Hirano, L. S. Fan, J. Q. Gao, and W. Y. Lee, J. Microelectromech. Syst., 7(2), 149 (1998).
13. J. L. McCrea, G. Palumbo, G. D. Hibbard, and U. Erb, Rev. Adv. Mater. Sci., 5, 252 (2003), http://www.ipme.ru/e-journals/RAMS/no-3503/mccrea/mccrea. pdf.
14. H. S. Cho, K. J. Hemker, K. Lian, J. Goettert, and G. Dirras, Sens. Actuators, A, 103, 59 (2003).
15. T. Osaka, Electrochim. Acta, 45, 3311 (2000).
16. W. P. Taylor, M. Schneider, H. Baltes, and M. G. Allen, Electrochem. Solid State Lett., 2, 624 (1999).
17. Y. Sverdlov, Y. Rosenberg, Yu. I. Rozenberg, R. Zmood, R. Erlich, S. Natan, and Y. Shacham-Diamand, Microelectronic Eng., 76, 258 (2004).
18. L. Philippe, C. Heiss, and J. Michler, Chem. Mater., 20, 3377 (2008).
19. Y. Hubenova, R. Rashkov, V. Buchvarov, S. Babanova, and M. Mitov, J. Mater. Sci., 46, 7074 (2011).
20. C. Cheung, F. Djuanda, U. Erb, and G. Palumbo, Nanostruct. Mater., 5, 513 (1995).
21. F. Ebrahimi and H. Li, Scripta Mater., 55, 263 (2006).
22. H. Li, F. Jiang, S. Ni, L. Li, G. Sha, X. Liao, S. P. Ringer, H. Choo, P. K. Liaw, and A. Misra, Scripta Mater., 65, 1 (2011).
23. F. Czerwinski, J. A. Szpunar, and U. Erb, J. Mater. Sci. Mater. Electron., 11, 243 (2000).
24. H. Q. Li and F. Ebrahimi, Acta Mater., 51, 3905 (2003).
25. J. K. Kim, J. H. Seo, and Y. B. Park, Mater. Sci. Forum, 467-470, 1313 (2004).
26. S.-H. Kim, H.-J. Sohn, Y. C. Joo, Y.-W. Kim, T.-H. Yim, H.-Y. Lee, and T. Kang, Surf. Coat. Technol., 199, 43 (2005).
27. L. Yichun, L. Lei, S. Bin, and Hu Wenbin, Mater. Sci. Eng. A, 528, 5701 (2011).
28. F. Czerwinski, J. Electrochem. Soc., 143, 3327 (1996).
29. F. Czerwinski, Electrochim. Acta, 44, 667 (1998).
30. F. Czerwinski, J. Mat. Sci., 33, 3831 (1998).
31. D. L. Grimmet, M. Schwartz, and K. Nobe, J. Electrochem. Soc., 140, 973 (1993).
32. N. V. Myung and K. Nobe, J. Electrochem. Soc., 148, C136 (2001).
33. S. D. Leith, S. Ramli, and D. T. Schwartz, J. Electrochem. Soc., 146, 1431 (1999).
34. I. Tabakovic, V. Inturi, J. Thurn, and M. Kief, Electrochim. Acta, 55, 6749 (2010).
35. C. Rousse and P. Fricoteaux, J. Mater. Sci., 46, 6046 (2011).
36. H. Li and F. Ebrahimi, Mat. Sci. Eng. A, 347, 93 (2003).
37. J. W. Dini, H. R. Johnson, and L. A. West, Plat. Surf. Finish., 65, 36 (1978).
38. T. E. Buchheit, S. H. Goods, P. G. Kotula, and P. F. Hlava, Mat. Sci. Eng. A, 432, 149 (2006).
39. G. S. Frankel, V. Brusic, R. G. Schad, and J.-W. Chang, Corr. Sci., 35, 63 (1993).
40. I. Tabakovic, S. Riemer, K. Tabakovic, M. Sun, and M. Kief, J. Electrochem. Soc., 153, C586 (2006).
41. S. R. Brankovic, R. Haislmaier, and N. Vasiljevic, Electrochem. Solid-State Lett., 10, D67 (2007).
42. R. Weil, Plating, 58, 50 (1971).
43. A. Vicenzo and P. L. Cavallotti, Met. It., 95(5), 13 (2003).
44. P. Scherrer, Göttinger Nachrichten Math. Phys., 2, 98 (1918).
45. T. P. Hoar and D. J. Arrowsmith, Trans. Inst. Met. Finish., 34, 354 (1957).
46. J. M. Sykes and G. P. Rothwell, J. Electrochem. Soc., 118, 91 (1971).
47. L. J. Swartzendruber, V. P. Itkin, and C. B. Alcock, J. Phase Equilibria, 12, 288 (1991).
48. K. B. Reuter, D. B. Williams, and J. I. Goldstein, Metall. Trans. A, 20, 719 (1989).
49. P. L. Cavallotti, L. Nobili, and A. Vicenzo, Electrochim. Acta, 50, 4557 (2005).
50. A. Brenner, Electrodeposition of Alloys, Vol. 2, p.301, Academic Press, New York (1963).
51. M. L. Trudeau, Nanostruct. Mater., 12, 55 (1999).
52. J. S. Marsh, Alloys of Iron and Nickel, Vol. 1, p.117, McGraw-Hill, London (1938).
53. A. E. Vol, Handbook of Binary Metallic Systems, p. 524, Israel Program for Scientific Translation, Jerusalem (1967).
54. R. P. Reed and R. E. Schramm, J. Appl. Phys., 40, 3453 (1969).
55. D. K. Chaudhuri, P. A. Ravindran, and J. J. Wert, J. Appl. Phys., 43, 778 (1972).
56. A. Vicenzo and P. L. Cavallotti, J. Russ. Electrochem., 44, 716 (2008).
57. D. B. Lewis, C. E. Lehmberg, and G. W. Marshall, Trans. Inst. Met. Finish., 79(2), 60 (2001).
58. F. Ebrahimi and H. Li, Rev. Adv. Mater. Sci., 5, 134 (2003), http://www.ipme.ru/ e-journals/RAMS/no-2503/ebrahimi/ebrahimi.pdf.
59. F. Ebrahimi and H. Li, J. Mater. Sci., 42, 1444 (2007).
60. S. E. Hadian and D. R. Gabe, Surf. Coat. Technol., 122, 118 (1999).
61. G. S. Sotirova-Chakarova and S. A. Armyanov, J. Electrochem. Soc., 137, 3551 (1990).
62. S. Nakahara and C. Felder, J. Electrochem. Soc., 129, 45 (1982).
63. S. Nakahara and S. Mahajan, J. Electrochem. Soc., 127, 283 (1980).
64. M. L. Holzworth and M. R. Louthan, Corrosion, 24, 110 (1968).
65. A. Szummer and A. Janko, Corrosion, 35, 461 (1979).
66. A. Baranowski, in Hydrogen in Metals II, G. Alefeld and J. Völkl, Editors, p. 173, Springer Verlag, Berlin (1978).
67. H. M. Lee, Metall. Trans., 7A, 431 (1976).
68. S. W. Stafford and R. B. McLellan, Acta Met., 24, 553 (1976).
69. D. M. Doyle, G. Palumbo, K. T. Aust, A. M. El-Sherik, and U. Erb, Acta Metall. Mater., 43, 3027 (1995).
70. P. L. Cavallotti and A. Vicenzo, in Fundamental Aspects of Electrochemical Deposition and Dissolution, M. Matlosz, D. Landolt, R. Aogaki, Y. Sato, and J. B. Talbot, Editors, PV 99-33, pp. 123, The Electrochemical Society Proceedings Series, Pennington, NJ (2000).
71. A. Vicenzo and P. L. Cavallotti, Electrochim. Acta, 49, 4079 (2004).
72. H. Fischer, Electrodepos. Surface Treat., 1, 239 (1972/73)
73. Ibidem, 1, 319 (1972/73).
74. B. S. Murty, M. K. Datta, and S. K. Pabi, Sadhana, 28(1-2), 23 (2003).
75. T.-R. Lee, L. Chang, and C.-H. Chen, Surf. Coat. Technol., 207, 523 (2012).
76. R. A. Howald, Met. Mat. Trans. A, 34A, 1759 (2003).
77. T. J. Rupert, J. C. Trenle, and C. A. Schuh, Acta Mater., 59, 1691 (2011).
78. N. Huber and J. Heerens, Acta Mater., 56, 6205 (2008).
79. J. K. Luo,M. Pritschow, A. J. Flewitt, S. M. Spearing, N. A. Fleck, andW. I. Milnea, J. Electrochem. Soc., 153, D155 (2006).
80. L. Chang, P. W. Kao, and C.-H. Chen, Scripta Mater., 56, 713 (2007).
81. M. Yuasa, M. Hakamada, H. Nakano, M. Mabuchi, and Y. Chino, J. Phys.: Condens. Matter, 25, 345702 (2013).
82. L.-H. Yi, C.-Y. Lee, L. Chang, T.-R. Lee, and P.-W. Kao, J. Mat. Research, 26, 2533 (2011).
83. K. E. Volk, Nickel und Nickellegierungen, p. 46, Springer-Verlag, Berlin (1970).
84. H. S. Kim and M. B. Bush, Nanostr. Mater., 11, 361 (1999).
85. T. Fritz, M. Griepentrog, W. Mokwa, and U. Schnakenberg, Electrochim. Acta, 48, 3029 (2003).
86. J. D. Giallonardo, U. Erb, K. T. Aust, and G. Palumbo, Phil. Mag., 91, 4594 (2011).