The electrodeposition of cobalt-nickel-iron high aspect ratio thick film structures for magnetic MEMS applications

Microelectronic Engineering

Volumn 76, Issue 1-4, 2004, Pages 258-265

  Sverdlov, Yelena ^a   Rosenberg, Yuri ^a   Rozenberg, Yu I ^a   Zmood, Ron ^b   Erlich, Raviv ^c   Natan, Sivan ^c   Shacham Diamand, Yosi ^a  

^a TEL AVIV UNIVERSITY   (Israel)

^b RMIT UNIVERSITY   (Australia)

^c Elbit Systems Electro Optics Elop Limited   (Israel)

Author keywords

CoNiFe alloys; Electrodeposition; High Bs thick film

Indexed keywords

ASPECT RATIO; COBALT ALLOYS; CYCLIC VOLTAMMETRY; ELECTROCHEMISTRY; ELECTRODEPOSITION; ELECTRODES; MAGNETIC THICK FILMS;

CONIFE ALLOYS; ELECTROCHEMICAL POTENTIAL; SOFT MAGNETIC FILMS;

MICROELECTROMECHANICAL DEVICES;

EID: 4544232434     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.07.039     Document Type: Conference Paper

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