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Volumn 56, Issue 8, 2007, Pages 713-716

Strengthening mechanisms in electrodeposited Ni-P alloys with nanocrystalline grains

Author keywords

Grain boundaries; Nanocrystalline; Ni alloys; Ni3P; Strengthening mechanism

Indexed keywords

ANNEALING; BINARY ALLOYS; ELECTRODEPOSITION; GRAIN BOUNDARIES; NANOSTRUCTURED MATERIALS; PRECIPITATION (CHEMICAL); STRENGTH OF MATERIALS;

EID: 33846820295     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2006.12.036     Document Type: Article
Times cited : (86)

References (27)
  • 15
    • 33846842814 scopus 로고    scopus 로고
    • L. Chang, C.-H. Chen, H. Fung, D.-S. Hwang, unpublished data.
  • 16
    • 33846832987 scopus 로고    scopus 로고
    • C.C. Koch, J. Narayan, in: D. Farkas, H. Kung, M. Mayo, H. Van Swygenhoven, J. Weertman (Eds.), Structure and Mechanical Properties - Theory and Computer Simulations vs. Experiment, Mat. Res. Soc. Symp. Proc. vol. 634. 2001, pp. B. 5.1.1.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.