Scalable graphite/copper bishell composite for high-performance interconnects

ACS Nano

Volumn 8, Issue 1, 2014, Pages 275-282

  Yeh, Chao Hui ^a   Medina, Henry ^a   Lu, Chun Chieh ^a   Huang, Kun Ping ^b   Liu, Zheng ^c   Suenaga, Kazu ^c   Chiu, Po Wen ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^c NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

chemical vapor deposition; graphene; interconnect; low temperature

Indexed keywords

ELECTRICAL INTERCONNECTS; ELECTRON CYCLOTRON RESONANCE CHEMICAL VAPOR DEPOSITION; FABRICATION AND CHARACTERIZATIONS; INTERCONNECT; LOW TEMPERATURES; MAXIMUM CURRENT DENSITY; MULTILAYER GRAPHENE; THERMAL DISSIPATION;

CHEMICAL VAPOR DEPOSITION; GRAPHENE; MODELS; TEMPERATURE; VAPORS;

GRAPHITE;

EID: 84893456870     PISSN: 19360851     EISSN: 1936086X     Source Type: Journal    
DOI: 10.1021/nn4059456     Document Type: Article

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