Effects of multi-layer graphene capping on Cu interconnects

Nanotechnology

Volumn 24, Issue 11, 2013, Pages

  Kang, Chang Goo ^a   Lim, Sung Kwan ^a   Lee, Sangchul ^a   Lee, Sang Kyung ^a   Cho, Chunhum ^a   Lee, Young Gon ^a   Hwang, Hyeon Jun ^a   Kim, Younghun ^a   Choi, Ho Jun ^a   Choe, Sun Hee ^a   Ham, Moon Ho ^a   Lee, Byoung Hun ^a  

^a Gwangju Institute of Science and Technology (GIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BREAKDOWN CURRENTS; CAPPING MATERIALS; CU WIRES; CU-INTERCONNECTS; END-OF-LINE; HIGH DENSITY; RELIABILITY CHARACTERISTICS;

OPTIMIZATION; WIRE;

GRAPHENE;

EID: 84874866241     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/24/11/115707     Document Type: Article

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