Bilayer graphene/copper hybrid on-chip interconnect: A reliability study

IEEE Transactions on Nanotechnology

Volumn 10, Issue 4, 2011, Pages 710-714

  Yu, Tianhua ^a   Lee, Eun Kyu ^a   Briggs, Benjamin ^a   Nagabhirava, Bhaskar ^a   Yu, Bin ^a  

^a STATE UNIVERSITY OF NEW YORK   (United States)

Author keywords

Bilayer graphene (BLG); breakdown; current annealing; interconnect; reliability

Indexed keywords

BI-LAYER; BILAYER GRAPHENE (BLG); BREAKDOWN; BREAKDOWN BEHAVIOR; BREAKDOWN CURRENTS; BREAKDOWN MECHANISM; CURRENT ANNEALING; INTERCONNECT; INTERCONNECT SYSTEMS; LIMITING FACTORS; LINEAR DEPENDENCE; ON CHIP INTERCONNECT; THERMAL-ANNEALING;

ASPECT RATIO; FAILURE ANALYSIS; INTERCONNECTION NETWORKS;

GRAPHENE;

EID: 79960274596     PISSN: 1536125X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TNANO.2010.2071395     Document Type: Article

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