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Volumn , Issue , 2002, Pages 50-52
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Silicon thinning and stacked packages
a
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Author keywords
[No Author keywords available]
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Indexed keywords
CRYSTAL DEFECTS;
GRINDING (MACHINING);
RELIABILITY;
SEMICONDUCTOR DEVICE MANUFACTURE;
SILICON WAFERS;
STRESS RELIEF;
SURFACES;
THERMODYNAMIC PROPERTIES;
DICING BEFORE GRINDING;
FINE GRINDING WHEEL;
ROUGH GRINDING PROCESS;
SILICON THINNING;
THERMAL RELIABILITY;
ELECTRONICS PACKAGING;
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EID: 0036395304
PISSN: 10898190
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (7)
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References (0)
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