MEASUREMENT OF SILICON STRENGTH AS AFFECTED BY WAFER BACK PROCESSING.

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1987, Pages 216-223

  Hawkins, George ^a   Berg, Howard ^a   Mahalingam, Mali ^a   Lewis, Gary ^a   Lofgran, Lynn ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MECHANICAL VARIABLES MEASUREMENT - STRAIN; MICROSCOPIC EXAMINATION;

GROUND WAFER; LAPPED WAFER; SILICON STRENGTH; SILICON WAFER; WAFER BACK PROCESSING;

SEMICONDUCTING SILICON;

EID: 0023249629     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/irps.1987.362182     Document Type: Conference Paper

References (5)