Encapsulation for flexible electronic devices

IEEE Electron Device Letters

Volumn 32, Issue 12, 2011, Pages 1743-1745

  Kinkeldei, Thomas ^a   Munzenrieder, Niko ^a   Zysset, Christoph ^a   Cherenack, Kunigunde ^a   Tröster, Gerhard ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

Bending; Encapsulation; Flexible electronics; Thin films; Transistor

Indexed keywords

BENDING RADIUS; ENCAPSULATION METHODS; FLEXIBLE ELECTRONIC DEVICES; FLEXIBLE POLYIMIDE; FLEXIBLE POLYIMIDE SUBSTRATE; INORGANIC MATERIALS; LOW PROCESS TEMPERATURE; MECHANICAL IMPACTS; MECHANICAL STRESS; SATURATION MOBILITY; THIN FILM LAYERS; THRESHOLD VOLTAGE SHIFTS;

BENDING (FORMING); ENCAPSULATION; FILMS; FLEXIBLE ELECTRONICS; POLYIMIDES; STRESSES; SUBSTRATES; THERMOELECTRIC EQUIPMENT; THIN FILM DEVICES; THIN FILM TRANSISTORS; THIN FILMS; THRESHOLD VOLTAGE; TRANSISTORS;

ELECTRON DEVICES;

EID: 81855217345     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2011.2168378     Document Type: Article

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