Recycling a slurry for reuse in chemical mechanical planarization of tungsten wafer: Effect of chemical adjustments and comparison between static and dynamic experiments

Microelectronic Engineering

Volumn 113, Issue , 2014, Pages 114-122

  Testa, F ^a,b   Coetsier, C ^a,c   Carretier, E ^a   Ennahali, M ^b   Laborie, B ^b   Moulin, P ^a  

^a AIX MARSEILLE UNIVERSITY   (France)

^b KEMESYS   (France)

^c UNIVERSITÉ DE TOULOUSE   (France)

Author keywords

Chemical adjustments; Chemical mechanical polishing; Design of experiments; Slurry; Tungsten film

Indexed keywords

CHEMICAL COMPOSITIONS; CHEMICAL MECHANICAL POLISHING(CMP); COST OF MANUFACTURING; DYNAMIC EXPERIMENT; EFFECT OF CHEMICALS; MICROCHIP PROCESSORS; STATIC AND DYNAMIC CONDITIONS; TUNGSTEN FILMS;

ABRASIVES; CHEMICAL MECHANICAL POLISHING; DESIGN OF EXPERIMENTS; EXPERIMENTS; RECYCLING; SLURRIES; ULTRAFILTRATION;

TUNGSTEN;

EID: 84883369039     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2013.07.022     Document Type: Article

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