Advances in chemical-mechanical planarization

MRS Bulletin

Volumn 27, Issue 10, 2002, Pages 743-748

  Singh, Rajiv K ^a   Bajaj, Rajeev ^a  

^a UNIVERSITY OF FLORIDA   (United States)

Author keywords

Chemical mechanical planarization; Chemical mechanical polishing; CMP; Copper interconnects; Low dielectrics; Nanotopography; Shallow trench isolation; Silica polishing; Slurry design

Indexed keywords

ABRASIVES; MICROPROCESSOR CHIPS; SILICA; SLURRIES; SURFACE TOPOGRAPHY; TRANSISTORS;

CHEMICAL-MECHANICAL PLANARIZATION (CMP);

CHEMICAL MECHANICAL POLISHING;

EID: 0036802598     PISSN: 08837694     EISSN: None     Source Type: Journal    
DOI: 10.1557/mrs2002.244     Document Type: Article

References (20)

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14. For CMP tools, see Applied Materials Inc. Home Page, http://www.amat.com; the EBARA Technologies Inc. Home Page, http://www.ebaratech.com; and the Lam Research Home Page, http://www.lamrc.com (accessed July 2002).
15. R.K. Singh, R. Bajaj, M. Moinpour, and M. Meuris, eds., Chemical-Mechanical Polishing 2000: Fundamentals and Materials Issues (Mater. Res. Soc. Symp. Proc. 613, Warrendale, PA, 2001).
16. R. Vacassy, R.J. Flatt, H. Hofmann, K.S. Choi, and R.K. Singh, J. Colloid Interface Sci. 227 (2000) p. 302.
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19. R.K. Singh and S.-M. Lee (unpublished).
20. T.H. Lee, Sci. Am. 52 (January 2002) p. 286.