CMP CoO reduction: Slurry reprocessing

Thin Solid Films

Volumn 308-309, Issue 1-4, 1997, Pages 538-542

  Bibby, Thomas F A ^a   Adams, John A ^a   Holland, Karey ^a   Krulik, Gerald A ^a   Parikh, Paul ^a  

^a IPEC Planar   (United States)

Author keywords

Chemical mechanical planarization; Oxide; Reprocessing; Slurry

Indexed keywords

OXIDES; SEMICONDUCTING FILMS; SEMICONDUCTOR DEVICE MANUFACTURE; SLURRIES;

CHEMICAL MECHANICAL PLANARIZATION (CMP); SLURRY REPROCESSING;

CHEMICAL POLISHING;

EID: 0031250440     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(97)00496-3     Document Type: Article

References (3)

1. Cote; J. William, Leach; A. Michael. 'Wafer flood polishing' US Patent 4,910,155, March 20, 1990.
2. Cadien; C. Kenneth, Feller; A. Daniel, 'Slurries for chemical mechanical polishing' US Patent 5,340,370, August 23, 1994.
3. Chandler; F William, et al 'Slurry containment device for polishing semiconductor wafers' US Patent 5,299,393, April 5, 1994.