Utility of dodecyl sulfate surfactants as dissolution inhibitors in chemical mechanical planarization of copper

Journal of Materials Research

Volumn 20, Issue 12, 2005, Pages 3413-3424

  Hong, Y ^a   Patri, U B ^b   Ramakrishnan, S ^b   Roy, D ^a   Babu, S V ^a  

^a CLARKSON UNIVERSITY   (United States)

^b Clarkson University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT ANGLE; CORROSION; DISSOLUTION; SLURRIES; SULFUR COMPOUNDS; SURFACE ACTIVE AGENTS; SURFACE TOPOGRAPHY;

AMMONIUM DODECYL SULFATE (ADS); ANIONIC SURFACTANTS; CHEMICAL MECHANICAL PLANARIZATION (CMP); SODIUM DODECYL SULFATE (SDS);

COPPER;

EID: 30444441118     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2005.0419     Document Type: Article

References (68)

1. P.B. Zantye, A. Kumar, and A.K. Sikdar: Chemical mechanical planarization for microelectronics applications. Mater. Sci. Eng. R45, 89 (2004).
2. Chemical-Mechanical Polishing 2001-Advances and Future Challenges, edited by S.V. Babu, K.C. Cadien, and H. Yano (Mater. Res. Soc. Symp. Proc. 671, Warrendale, PA, 2001).
3. J.M. Steigerwald, S.P. Murarka, and R. Gutmann: Chemical Mechanical Planarization of Microelectronic Materials (Wiley, New York, 1997).
4. A. Ulman: An Introduction to Ultra thin Organic Films (Academic Press, Boston, MA, 1991).
5. P. Somasundaran and S. Krishnakumar: Adsorption of surfactants and polymers at the solid-liquid intetrface. Colloids Surf. 123, 191 (1997).
6. M. Itano, T. Kezuka, M. Ishii, T. Unemoto, M. Kubo, and T. Ohmi: Minimization of particle contamination during wet processing of Si wafers. J. Electrochem. Soc. 142, 971 (1995).
7. T. Ohmi: Total room temperature wet cleaning for Si substrate surface. J. Electrochem. Soc. 143, 2957 (1996).
8. J.J. Adler, P.K. Singh, A. Patist, Y.I. Rabinovich, D.O. Shah, and B.M. Moudgil: Correlation of particulate dispersion stability with the strength of self-assembled surfactant films. Langmuir 16, 7255 (2000).
9. G.B. Basim, I.U. Vakarelski, and B.M. Moudgil: Role of interaction forces in controlling the stability and polishing performance of CMP slurries. J. Colloid Interf. Scl. 263, 506 (2003).
10. B.J. Palla and D.O. Shah: Stabilization of high ionic strength slurries using surfactant mixtures: molecular factors that determine optimal stability. J. Colloid Interf. Sci. 256, 143 (2002).
11. D-W. Lee, N-H. Kim, and E-G. Chang: Effect of nonionic surfactants on the stability of alumina slurry for Cu CMP. Mater. Sci. Eng. B 118, 293 (2005).
12. M. Colic and D.W. Fuerstenau: Influence of the dielectric constant of the media on oxide stability in surfactant solutions. Langmuir 13, 6644 (1997).
13. M.J. Solomon, T. Saeki, M. Wan, P.J. Scales, D.V. Boger, and H. Usui: Effect of adsorbed surfactants on the rheology of colloidal zirconia suspensions. Langmuir 15, 20 (1999).
14. L.K. Koopal, T. Goloub, A. deKaiser, and M.P. Sidorova: The effect of cationic surfactants on wetting, colloid stability and flotation of silica. Colloids Surf. 151, 15 (1999).
15. K.E. Bremmel, G.J. Jameson, and S. Biggs: Adsorption of ionic surfactants in particulate systems: Flotation, stability, and interaction forces. Colloids Surf. 146, 75 (1999).
16. C.R. Evanko, D.A. Dzombak, and J.W. Novak: Influence of surfactant addition on the stability of concentrated alumina dispersions in water. Colloids Surf. 110, 219 (1996).
17. Q. Luo, D.R. Campbell, and S.V. Babu: Stabilization of alumina slurry for chemical-mechanical polishing of copper. Langmuir 12, 3563 (1996).
18. J.D. Barry, A. Babel, and D.R. Campbell: CMP consumables in chemical-mechanical polish (C.M.P) for ULSI multilevel inter-connection conference (VMIC Proc. 97ISMIC-200P, Tampa, FL, 1997), p. 322.
19. H. Ma, S. Chen, B. Yin, S. Zhao, and X. Liu: Impedance spectroscopic study of corrosion inhibition of copper by surfactants in the acidic solutions. Corros. Sci. 45, 867 (2003).
20. R. Fuchs-Godec and V. Dolěcek: An effect of sodium dodecyl-sulfate on the corrosion of copper in sulphuric acid media. Colloids Surf. A 244, 73 (2004).
21. R.F.V. Villamil, P. Corio, J.C. Rubim, and S.M.L. Agostinho: Sodium dodecylsulfate-benzotriazole synergistic effect as an inhibitor of processes on copper I chloric acid interface. J. Electroanal. Chem. 535, 75 (2002).
22. R.F.V. Villamil, P. Corio, J.C. Rubim, and S.M.L. Agostinho: Effect of sodium dodecylsulfate on copper corrosion in sulfuric acid media in the absence and presence of benzotriazole. J. Electroanal. Chem. 472, 112 (1999).
23. Y. Hong, U.B. Patri, S. Ramakrishnan, and S.V. Babu: Novel use of surfactants in chemical copper mechanical polishing (CMP), in Chemical-Mechanical Planarization-Integration, Technology, and Reliability, edited by A. Kumar, J.A. Lee, Y.S. Obeng, I. Vos, and E.C. Johns (Mater. Res. Soc. Proc. 867, Warrendale, PA, 2005), W1.10, p. 41.
24. 2 and glycine in chemical mechanical polishing of copper studied with impedance spectroscopy. D. Roy. J. Electrochem. Soc. 151, G717 (2004).
25. Y. Li, M. Hariharaputhiran, and S.V. Babu: Chemical-mechanical polishing of Cu and Ta films using silica abrasives. J. Mater. Res. 16, 867 (2001).
26. S. Aksu and F.M. Doyle: The role of glycine in the chemical mechanical planarization of copper. J. Electrochem. Soc. 149, G352 (2002).
27. D. Papapanayiotou, H. Deligianni, and R.C. Alkire: Effect of benzotriazole on the anisotropic electrolytic etching of copper. J. Electrochem. Soc. 145, 3016 (1998).
28. B-S. Fang, C.G. Olson, and D.W. Lynch: A photoemission study of benzotriazole on clean copper and cuprous oxide. Surf. Sci. 176, 476 (1986).
29. M.A. Abed, A. Saxena, and H.B. Bohidar: Micellization of alpha-olefin sulfonate in aqueous solutions studied by turbidity, dynamic light scattering and viscosity measurements. Colloids Surf. A 233, 181 (2004).
30. A. Cifuentes, J.L. Bernal, and J.C. Diez-Masa: Determination of critical micelle concentration values using capillary electrophoresis instrumentation. Anal. Chem 69, 4271 (1997).
31. V.L. Kolev, K.D. Danov, P.A. Kralchevsky, G. Broze, and A. Mehreteab: Comparison of the van der Waals and Frumkin adsorption isotherms for sodium dodecyl sulfate at various salt concentrations. Langmuir 18, 9106 (2002).
32. G.B. Sigal, M. Mrksich, and G.M. Whitesides: Using surface plasmon resonance spectroscopy to measure the association of detergents with self-assembled monolayers of hexadecanethiolate on gold. Langmuir 13, 2749 (1997).
33. I. Burgess, V. Zamlynny, G. Szymanski, J. Lipkowski, J. Majewski, G. Smith, S. Satija, and R. Ivkov: Electrochemical and neutron reflectivity characterization of dodecyl sulfate adsorption and aggregation at the gold-water interface. Langmuir 17, 3355 (2001).
34. S. Wolf: Silicon Processing for the ULSI Era (Lattice Press, Sunset Beach, CA, 1995), p. 1.
35. K-H. Kang, H-U. Kim, and K-H. Lim: Effect of temperature on critical micelle concentration and thermodynamic potentials of micellization of anionic ammonium dodecyl sulfate and cationic octadecyl trimethyl ammonium chloride. Colloids Surf. A 189, 113 (2001).
36. Q. Luo, D.R. Campbell, and S.V. Babu: Chemical-mechanical polishing of copper in alkaline media. Thin Solid Films 311, 177 (1997).
37. J.M. West: Basic Corrosion and Oxidation (Ellis Horwood, New York, NY, 1986).
38. K.A. Assiongbon, S.B. Emery, V.R.K. Gorantla, S.V. Babu, and D. Roy: Electrochemical impedance characteristics of Ta/Cu contact regions in polishing slurries used for chemical mechanical planarization of Ta and Cu: Considerations of galvanic corrosion. Corros. Sci. (2005, in press).
39. 2-amino acid mixtures and chemical mechanical polishing of copper. J. Electroehem. Soc. 147, 3820 (2000).
40. V.R.K. Gorantla, K.A. Assiongbon, S.V. Babu, and D. Roy: Citric acid as a complexing agent in chemical-mechanical planarization of copper: Investigation of surface reactions using impedance spectroscopy. J. Electrochem. Soc. 152, G404 (2005).
41. P.C. Goonetilleke and D. Roy: Electrochemical-mechanical planarization of copper: Effects of chemical additives on voltage controlled removal of surface layers in electrolytes. Mater. Chem. Phys. 94, 388 (2005).
42. J.M. Bastidas, P. Pinilla, E. Cano, J.L. Polo, and S. Miguel: Copper corrosion inhibition by triphenylmethane derivatives in sulphuric acid media. Corros. Sci. 45, 427 (2003).
43. J. Hernandez, P. Wrschka, and G.S. Oehrlein: Surface chemistry studies of copper chemical mechanical planarization. J. Electrochem. Soc. 148, G389 (2001).
44. D.W. Fuerstenau: Equilibrium and nonequilibrium phenomena associated with the adsorption of ionic surfactants at solid-water interfaces. J. Colloid Interface Sci. 256, 79 (2002).
45. E.M. Lee and L.K. Koopal: Adsorption of cationic and anionic surfactants on metal oxide surfaces: Surface charge adjustment and competition effects. J. Colloid Interface Sci. 177, 478 (1996).
46. 2H-NMR to determine the aggregate shape. J. Colloid Interface Sci. 172, 510 (1995).
47. A. Lalitha, S. Ramesh, and S. Rajeswari: Surface protection of copper in acid medium by azoles and surfactants. Electrochim. Acta. 51, 47 (2005).
48. A. Jindal and S.V. Babu: Effect of pH on chemical-mechanical polishing of Cu and Ta. J. Electrochem. Soc. 151, G709 (2004).
49. J. Duval, J. Lyklema, J.M. Kleijn, and H.P. van Leeuwen: Amphifunctionally electrified interfaces: Coupling of electronic and ionic surface-charging processes. Langmuir 17, 7573 (2001).
50. M. Kosmulski and J.B. Rosenholm: High ionic strength electrokinetics. Adv. Colloid Interface Sci. 112, 93 (2004).
51. A.J. Bard and L.R. Faulkner: Electrochemical Methods, Fundamentals and Applications (John Wiley, New York, 1980).
52. B.I. Podlovchenko and E.A. Kolyakdo: A correlation between the changes in total charge and open circuit potential of a hydrogen electrode during the adsorption of neutral particles and the formation of adatoms from ions. J. Electroanal. Chem. 506, 11 (2001).
53. G.A. Park: The isoelectric points of solid oxides, solid hydroxides, and aqueous hydroxo complex systems. Chem. Rev. 65, 177 (1965).
54. M.L. Foresti, G. Pezzatini, and M. Innocenti: Electrochemical behaviour of the Cu(110) water interface. J. Electroanal. Chem. 434, 191 (1997).
55. M.A. Lovell, M.J. Walters, and D. Roy: Effects of sub-surface oxygen on electrodeposition of cadmium on copper. Electrochim. Acta 43, 2101 (1998).
56. R. Gao, T.D. Hewitt, and D. Roy: Stark shift of an interband transition in Cu determined by surface charge measurements. J. Phys. Chem. Solids 54, 685 (1993).
57. T.D. Hewitt, R. Gao, and D. Roy: Effects of surface charge on the second harmonic generation from a Cu electrode. Surf. Sci. 291, 233 (1993).
58. A. Lukomska and J. Sobkowski: Potential of zero charge of monocrystalline copper electrodes in perchlorate solutions. J. Electroanal. Chem. 567, 95 (2004).
59. O. Koga, T. Matsuo, N. Hoshi, and Y. Hori: Charge displacement adsorption of carbon monoxide on [110] zone copper single crystal electrodes in relation with PZC. Electrochim. Acta 44, 903 (1998).
60. P-L. Chen, J-H. Chen, M-S. Tsai, B-T. Dai, and C-F. Yeh: Post-Cu CMP cleaning for colloidal silica abrasive removal. Microelectro. Eng. 75, 352 (2004).
61. A. Tulpar and W.A. Ducker: Surfactant adsorption at solid-aqueous interfaces containing fixed charges: Experiments revealing the role of surface charge density and surface charge regulation. J. Phys. Chem. B 108, 1667 (2004).
62. U. Retter and M. Tchachnikova: On the formation of surface micelles at the metal/etectrolyte interface. J. Electroanal. Chem. 550, 201 (2003).
63. A.A. Levchenko, B.P. Argo, R. Vidu, R.V. Talroze, and P. Stroeve: Kinetics of sodium dodecyl sulfate adsorption on and desorption from self-assembled monolayers measured by surface plasmon resonance. Langmuir 18, 8464 (2002).
64. K. Hu and A.J. Bard: Characterization od adsorption of sodium dodecyl sulfate on charge-regulated substrates by atomic force microscopy force measurements. Langmuir 13, 5418 (1997).
65. A.N. Davis, S.A. Morton III, R.M. Counce, D.W. DePaoli, and M.Z-C. Hu: Ionic strength effects on hexadecane contact angles on a gold-coated glass surface in ionic surfactant solutions. Colloids Surf. A 221, 69 (2003).
66. S.F. Turner, S.M. Clarke, A.R. Rennie, P.N. Thirtle, D.J. Cooke, Z.X. Li, and R.K. Thomas: Adsorption of sodium dodecyl sulfate to a polystyrene/water interface studied by neutron reflection and attenuated total reflection infrared spectroscopy. Langmuir 15, 1017 (1999).
67. J.M. Neirynck, G-R. Yang, S.P. Murarka, and R.J. Gutmann: The addition of surfactant to slurry for polymer CMP: Effects on polymer surface, removal rate and underlying Cu. Thin Solid Films 290, 447 (1996).
68. P. Bernard, Ph. Kapsa, T. Coudé, and J-C. Abry: Influence of surfactant and salts on chemical mechanical planarisation of copper. Wear 259, 1367 (2005).