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Volumn 254, Issue 5, 2007, Pages 1517-1523
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Modeling the effects of oxidizer, complexing agent and inhibitor on material removal for copper chemical mechanical polishing
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Author keywords
Chemical kinetics; Chemical mechanical polishing; Complexing agent; Copper; Inhibitor
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Indexed keywords
CHEMICAL MECHANICAL POLISHING;
MATHEMATICAL MODELS;
OXIDATION;
POLISHING;
REACTION KINETICS;
REMOVAL;
COMPLEXING AGENTS;
INHIBITORS;
MECHANICAL POLISHING;
OXIDIZERS;
COPPER;
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EID: 36249008618
PISSN: 01694332
EISSN: None
Source Type: Journal
DOI: 10.1016/j.apsusc.2007.07.005 Document Type: Article |
Times cited : (39)
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References (20)
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