Hotspot mitigating with obliquely finned microchannel heat sink-an experimental study

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 3, Issue 8, 2013, Pages 1332-1341

  Lee, Yong Jiun ^a   Lee, Poh Seng ^a   Chou, Siaw Kiang ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Enhanced microchannel; hotspot cooling; oblique fins; variable pitch

Indexed keywords

ENHANCED MICROCHANNELS; EXPERIMENTAL STUDIES; HEAT TRANSFER ENHANCEMENT; HOT SPOT; MICRO CHANNEL HEAT SINKS; OBLIQUE FINS; TEMPERATURE DIFFERENCES; VARIABLE PITCH;

BOUNDARY LAYERS; COOLING; COOLING SYSTEMS; SECONDARY FLOW; SILICON;

FINS (HEAT EXCHANGE);

EID: 84881477220     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2013.2244164     Document Type: Article

References (20)

1. A. Watwe and R. Viswanath, "Thermal implications of non-uniform die power map and CPU performance, " in Proc. ASME InterPACK, Maui, Hawaii, USA, 2003, pp. 1-16.
2. J. R. Black, "Electromigration-A brief survey and some recent results, " IEEE Trans. Electron Devices, vol. 16, no. 4, pp. 338-347, Apr. 1969.
3. A. Bar-Cohen, M. Arik, and M. Ohadi, "Direct liquid cooling of high flux micro and nano electronic components, " Proc. IEEE, vol. 94, no. 8, pp. 1549-1570, Aug. 2006.
4. E. S. Cho, J. M. Koo, L. Jiang, R. S. Prasher, M. S. Kim, J. G. Santiago, T. W. Kenny, and K. E. Goodson, "Experimental study on two-phase heat transfer in microchannel heat sink with hotspots, " in Proc. 19th IEEE Semicond. Thermal Meas. Manage. Symp., Mar. 2003, pp. 242-246.
5. T. Brunschwiler, H. Rothuizen, S. Paredes, B. Michel, E. Colgan, and P. Bezama, "Hotspot-adapted cold plates to maximize system efficiency, " in Proc. 15th Int. WorkshopThermal Invest. ICs Syst., 2009, pp. 150-156.
6. C. Green, A. G. Fedorov, and Y. K. Joshi, "Fluid-to-fluid spot-to-spreader (F2/S2) hybrid heat sink for integrated chip-level and hotspot-level thermal management, " in Proc. 11th IEEE Intersociety Conf. Thermal Thermomechanical Phenomena Electron. Syst., May. 2008, pp. 510-519.
7. P. S. Lee and S. V. Garimella, "Hot-spot thermal management with flow modulation in a microchannel heat sink, " in Proc. ASME Int. Mech. Eng. Congr. Exposit., 2005, pp. 643-647.
8. C. Bachmann and A. Bar-Cohen, "Hotspot remediation with anisotropic thermal interface materials, " in Proc. 11th IEEE Intersociety Conf. Thermal Thermomechanical Phenomena Electron. Syst., 2008, pp. 238-247.
9. P. Wang, A. Bar-Cohen, B. Yang, G. Solberkken, Y. Zhang, and A. Shak-ouri, "Thermoelectric microcooler for hot spot thermal management, " in Proc. Pacific Rim/ASME Int. Electron. Packag. Technol. Conf. Exhibit., 2005, pp. 2161-2171.
10. D. M. Rowe, "Bismuth telluride, antimony telluride and their solid solutions, " CRC Handbook of Thermoelectronics, Boca Raton, FL, USA: CRC Press, 1995, Ch. 19, pp. 211-238.
11. A. Shakouri, "Nanoscale thermal transport and microrefrigerators on a chip, " Proc. IEEE, vol. 94, no. 8, pp. 1613-1638, Aug. 2006.
12. V. Litvinovitch, P. Wang, and A. Bar-Cohen, "Superlattice μTEC hot spot cooling, " IEEE Trans. Compon. Packag. Technol., vol. 33, no. 1, pp. 229-239, Mar. 2010.
13. D. S. Chau, G. Chrysler, N. Sridhar, G. Deepak, and K. Lof-green, "Feasibility study of using solid state refrigeration technologies for electronic cooling, " in Proc. 10th IEEE Intersociety Conf. Thermal Thermomechanical Phenomena Electronic Syst., Jun. 2006, pp. 464-469.
14. Y. Zhang, J. Christofferson, A. Shakouri, G. Zeng, J. E. Bowers, and E. T. Croke, "On-chip high speed localized cooling using superlattice microrefrigerators, " IEEE Trans. Compon. Packag. Technol., vol. 29, no. 2, pp. 395-401, Jun. 2006.
15. Y. Zhang, G. Zeng, C. Hoffman, A. Bar-Cohen, and A. Shakouri, "Enhanced hot spot cooling using bonded superlattice microcoolers with a trench structure, " IEEE Trans. Compon. Packag. Technol., vol. 31, no. 3, pp. 552-558, Sep. 2008.
16. V. Sahu, Y. K. Joshi, and A. G. Fedorov, "Hybrid solid state/fluidic cooling for hotspot removal, " in Proc. 11th IEEE Intersociety Conf. Thermal Thermomechanical Phenomena Electron. Syst., May 2008, pp. 626-631.
17. A. Chauhan, B. Sammakia, K. Ghose, G. Refai-Ahmed, and D. Ago-nafer, "Hot spot mitigation using single-phase microchannel cooler for microprocessors, " in Proc. 12th IEEE Intersociety Conf. Thermal Thermomechanical Phenomena Electron. Syst., Jun. 2010, pp. 1-11.
18. Y. J. Lee, P. S. Lee, and S. K. Chou, "Enhanced microchannel heat sinks using oblique fins, " in Proc. 2009 ASME InterPACK Conf., 2009, pp. 253-260.
19. Y. J. Lee, P. S. Lee, and S. K. Chou, "Hot spot mitigating with oblique finned microchannel heat sink, " in Proc. ASME Int. Mech. Eng. Congr. Exposit., 2010, pp. 167-174.
20. Y. J. Lee, P. S. Lee, and S. K. Chou, "Enhanced thermal transport in microchannel using oblique fins, " J. Heat Transf., vol. 134, no. 10, pp. 101901-1-101901-10, 2012.