Superlattice μtEC hot spot cooling

IEEE Transactions on Components and Packaging Technologies

Volumn 33, Issue 1, 2010, Pages 229-239

  Litvinovitch, Viatcheslav ^a   Wang, Peng ^b   Bar Cohen, Avram ^c  

^a BAE SYSTEMS   (United States)

^b Electronic Cooling Solutions Inc   (United States)

^c UNIVERSITY OF MARYLAND   (United States)

Author keywords

Cooling; Hot spot; Microcooler; SiGe; Superlattice; Thermal management; Thermoelectric

Indexed keywords

CHIP THICKNESS; COOLING PERFORMANCE; FINITE ELEMENT MODELING; HEAT-FLOW PATTERNS; HOT SPOT; HOTSPOT TEMPERATURE; MICROCOOLER; MICROCOOLERS; NUMERICAL RESULTS; OPERATING CONDITION; SUPERLATTICE LAYERS; SURFACE TEMPERATURES; THERMAL MANAGEMENT; THERMOELECTRIC MICROCOOLERS;

ATMOSPHERIC TEMPERATURE; COOLING; FLOW PATTERNS; HEAT FLUX; MICROPROCESSOR CHIPS; NUMERICAL ANALYSIS; PELTIER EFFECT; SILICON ALLOYS; SOLID STATE DEVICES; SURFACE PROPERTIES; TEMPERATURE CONTROL; THERMOELECTRIC EQUIPMENT; THREE DIMENSIONAL;

SUPERLATTICES;

EID: 77949570690     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2009.2032297     Document Type: Article

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