Hotspot-adapted cold plates to maximize system efficiency

15th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2009

Volumn , Issue , 2009, Pages 150-156

  Brunschwiler, Thomas ^a   Rothuizen, Hugo ^a   Paredes, Stephan ^a   Michel, B ^a   Colgan, Evan ^b   Bezama, Pepe ^c  

^a IBM RESEARCH ZURICH   (Switzerland)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIR COOLING; COLD PLATES; COMPONENT LEVELS; CROSS FLOWS; CROSS-FLOW HEAT EXCHANGERS; DATA CENTERS; FLUID FLOW; FLUID TEMPERATURES; HEAT REMOVAL; HEATING NETWORK; HOT SPOT; IMPACT ON THE ENVIRONMENT; INCREASE IN PRESSURE; LIQUID COOLING; MESH LAYERS; MESH NETWORK; MODELING STUDIES; MULTIPLE HEAT SOURCES; ON-CHIP TEMPERATURE; POWER EFFICIENCY; PROCESSOR CHIPS; PUMPING POWER; SPATIAL CONTRAST; SYSTEM EFFICIENCY; THERMAL GREASE; TOTAL COST OF OWNERSHIP; TOTAL POWER CONSUMPTION; VOLUME FLOW;

CHIP SCALE PACKAGES; COOLING; COST REDUCTION; HEAT EXCHANGERS; HEAT TRANSFER; LIQUIDS; LUBRICATING GREASES; PLATES (STRUCTURAL COMPONENTS); PUMPS;

FLOW OF FLUIDS;

EID: 71749109201     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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