Enhanced microchannel heat sinks using oblique fins

Proceedings of the ASME InterPack Conference 2009, IPACK2009

Volumn 2, Issue , 2010, Pages 253-260

  Lee, Yong Jiun ^a   Lee, Poh Seng ^a   Chou, Siaw Kiang ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ENHANCEMENT OF HEAT TRANSFER; ENTRANCE EFFECTS; FLUID MIXING; HEAT TRANSFER ENHANCEMENT; HEAT TRANSFER PERFORMANCE; LEADING EDGE; LOCAL HEAT TRANSFER COEFFICIENT; MICRO CHANNEL HEAT SINKS; TEMPERATURE GRADIENT; THERMAL BOUNDARY LAYER; WALL TEMPERATURES;

BOUNDARY LAYERS; FORCED CONVECTION; HEAT EXCHANGERS; HEAT TRANSFER COEFFICIENTS; LAMINAR FLOW; MICROCHANNELS; NUMERICAL ANALYSIS; SECONDARY FLOW; VEHICULAR TUNNELS;

FINS (HEAT EXCHANGE);

EID: 77953919743     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/InterPACK2009-89059     Document Type: Conference Paper

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