Hot spot mitigation using single-phase microchannel cooling for microprocessors

2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2010

Volumn , Issue , 2010, Pages

  Chauhan, Anjali ^a,d   Sammakia, B ^a,d   Ghose, K ^a,d   Refai Ahmed, Gamal ^b,d   Agonafer, Dereje ^c,d  

^a BINGHAMTON UNIVERSITY   (United States)

^b AMD Inc

^c UNIVERSITY OF TEXAS AT ARLINGTON   (United States)

^d NONE   (United States)

Author keywords

Localized hot spots; Microchannel heat sink; Microprocessor; Optimized design; Thermal stresses

Indexed keywords

BASELINE DESIGN; CLOCK FREQUENCY; COMPUTATIONAL MODEL; DESIGN CHANGE; DEVICE FAILURES; ELECTRICAL DESIGN; HIGH THERMAL; HOT SPOT; INDIVIDUAL COMPONENTS; MICRO CHANNEL HEAT SINKS; MICROCHANNEL COOLING; MICROPROCESSOR; NEW DESIGN; NONUNIFORM; NUMERICAL SIMULATION; OPTIMIZATION STUDIES; OPTIMIZED DESIGNS; OPTIMIZED DEVICES; PERFORMANCE PENALTIES; POWER DISSIPATION; TEMPERATURE GRADIENT; THERMAL EMERGENCIES; THERMAL MANAGEMENT; TOTAL POWER; VOLTAGE-SCALING;

COMPUTER SIMULATION; DESIGN; ELECTRONICS ENGINEERING; HEAT SINKS; MICROCHANNELS; OPTIMIZATION; TEMPERATURE CONTROL; THERMAL GRADIENTS; THERMAL STRESS; THERMOANALYSIS; THERMOELASTICITY;

MICROPROCESSOR CHIPS;

EID: 77955213141     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2010.5501357     Document Type: Conference Paper

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