Experimental study on two-phase heat transfer in microchannel heat sinks with hotspots

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2003, Pages 242-246

  Cho, Eun Seok ^a   Koo, Jae Mo ^b   Jiang, Linan ^b   Prasher, Ravi S ^c   Kim, Min Soo ^a   Santiago, Juan G ^b   Kenny, Thomas W ^b   Goodson, Kenneth E ^b  

^a Seoul National University   (South Korea)

^b Stanford University   (United States)

^c INTEL CORPORATION   (United States)

Author keywords

Cross linked microchannel heat sink; Hotspot; Two phase heat transfer

Indexed keywords

COMPUTER SIMULATION; COOLING; HEAT CONVECTION; HEAT FLUX; MICROPROCESSOR CHIPS; PLASMA ETCHING; PRESSURE DROP; PRESSURE MEASUREMENT; SEMICONDUCTOR JUNCTIONS; SILICON WAFERS; TWO PHASE FLOW; ELECTRONIC COOLING; ELECTRONIC EQUIPMENT; ELECTRONIC EQUIPMENT TESTING; HEAT SINKS; HEAT TRANSFER; HEATING EQUIPMENT; INTEGRATED CIRCUITS; MATERIALS TESTING; MICROCHANNELS; NETWORKS (CIRCUITS); OSCILLATORS (ELECTRONIC); TEMPERATURE DISTRIBUTION; THERMAL VARIABLES MEASUREMENT; TRANSDUCERS;

HOTSPOTS; MASS FLOW DISTRIBUTION; MICROCHANNEL HEAT SINKS; TWO PHASE HEAT TRANSFER;

HEAT SINKS; HEAT CONVECTION;

CONVECTIVE HEAT TRANSFER; ELECTRONICS COOLING; HIGH-PERFORMANCE CIRCUITS; MICRO CHANNEL HEAT SINKS; NON-UNIFORM HEAT FLUXES; PLASMA TEMPERATURE; TEMPERATURE UNIFORMITY; TWO-PHASE HEAT TRANSFER;

EID: 0037275846     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Im, S., K. Banerjee, "Full Chip Thermal Analysis of Planar (2-D) and Vertically Integrated (3-D) High Performance ICs," Tech. Dig. IEDM, pp. 727-730, 2000.
2. Koo, J., L. Jiang, A. Bari, L. Zhang, E. Wang, T. W. Kenny, J. G. Santiago, K. E. Goodson, "Convective Boiling in Microchannel Heat Sinks with Spatially-Varying Heat Generation", Proc. ITherm, pp. 341-346, May 2002.
3. Koo, J., S. Im, E. S. Cho, R. S. Prasher, E. Wang, L. Jiang, A. Bari, D. Campion, D. Fogg, M. S. Kim, T. W. Kenny, J. G. Santiago, K. E. Goodson, "VLSI Hotspot Cooling Using Two-phase Microchannel Convection", Proc. ASME International Mechanical Engineering Congress & Exposition, IMECE 2002-39585, November 2002.
4. Jiang, L., J. Koo, A. Bari, E. Wang, E. S. Cho, W. Ong, R. S. Prasher, J. Maveety, M. S. Kim, T. W. Kenny, J. G. Santiago, K. E. Goodson, "Cross-linked Microchannels for VLSI hotspot Cooling", Proc. ASME International Mechanical Engineering Congress & Exposition, IMECE 2002-39238, November 2002.