Enhanced hot spot cooling using bonded superlattice microcoolers with a trench structure

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 3, 2008, Pages 552-558

  Zhang, Yan ^a   Zeng, Gehong ^b   Hoffman, Christine ^c   Bar Cohen, Avram ^d   Shakouri, Ali ^b  

^a Tessera Inc   (United States)

^b University of California Santa Cruz   (United States)

^c UNIVERSITY OF CALIFORNIA   (United States)

^d UNIVERSITY OF MARYLAND   (United States)

Author keywords

Cooling; Hot spot; Microrefrigerator; Trench

Indexed keywords

FUSION REACTIONS; METEOROLOGY; MICROELECTROMECHANICAL DEVICES; SILICON;

COOLING PERFORMANCE; COOLING POWER DENSITY; ELECTRO-THERMAL SIMULATIONS; FUSION BONDING; HOT SPOT; HOT SPOTTING; MAXIMUM COOLING; MICRO-COOLER; MICROCOOLERS; MICROREFRIGERATOR; SILICON CHIPS; SUPER LATTICES; TRENCH;

COOLING;

EID: 54849376600     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.2001833     Document Type: Article

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