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Volumn 134, Issue 10, 2012, Pages

Enhanced thermal transport in microchannel using oblique fins

Author keywords

electronic cooling; enhanced microchannel; oblique fins; thermal management

Indexed keywords

BOUNDARY LAYER THICKNESS; CONVECTIVE HEAT TRANSFER; COPPER-BASED; ENTRANCE EFFECTS; EXPERIMENTAL INVESTIGATIONS; FLUID MIXING; HEAT TRANSFER ENHANCEMENT; HEAT TRANSFER PERFORMANCE; LEADING EDGE; MAXIMUM TEMPERATURE RISE; MICRO CHANNEL HEAT SINKS; OBLIQUE FINS; PASSIVE TECHNIQUE; REINITIALIZATION; THERMAL BOUNDARY LAYER; THERMAL TRANSPORT; WORKING FLUID;

EID: 84864862800     PISSN: 00221481     EISSN: 15288943     Source Type: Journal    
DOI: 10.1115/1.4006843     Document Type: Article
Times cited : (190)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.