Hot spot mitigating with oblique finned microchannel heat sink

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 4, Issue , 2010, Pages 167-174

  Lee, Yong Jiun ^a   Lee, Poh Seng ^a   Chou, Siaw Kiang ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Enhanced microchannel; Hotspot cooling; Oblique fins; Variable pitch

Indexed keywords

BOUNDARY LAYERS; FINS (HEAT EXCHANGE); HEAT FLUX; HEAT TRANSFER COEFFICIENTS; MICROCHANNELS; SECONDARY FLOW; THERMAL MANAGEMENT (ELECTRONICS);

COOLING PERFORMANCE; ENHANCED MICROCHANNELS; FIN PITCH; HIGH HEAT FLUX; HOTSPOT COOLING; HOTSPOTS; MICRO CHANNEL HEAT SINKS; OBLIQUE FIN; REINITIALIZATION; VARIABLE PITCH;

COOLING;

EID: 84881415279     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2010-37817     Document Type: Conference Paper

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