Feasibility study of using solid state refrigeration technologies for electronic cooling

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 464-469

  Chau, David S ^a   Chrysler, Greg ^a   Narasimhan, Sridhar ^a   Ganapathy, Deepak ^a   Lofgreen, Kelly ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Hotspot cooling; Refrigeration; Solid state; Thermal solution; Thermoelectric; Thin film TEC

Indexed keywords

COMPUTER SIMULATION; COOLING SYSTEMS; ELECTRONICS PACKAGING; THERMOELECTRICITY; THIN FILMS;

HOTSPOT COOLING; SOLID STATE; THERMAL SOLUTION; THIN-FILM TEC;

REFRIGERATION;

EID: 33845567784     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645380     Document Type: Conference Paper

References (4)

1. Semiconductor Industry Association (SIA) International Technology Roadmap for Semiconductors, 2004.
2. Watwe, A. and Viswanath, R., "Thermal Implications of Non-Uniform Die Power and CPU Performance," Paper No. IPACK2003-35044, presented at InterPack '03, Maui, Hawaii, USA.
3. Vandersande & Fleurial, 15th International Conference on Thermoelectrics (1996).
4. Prasher, R., Chang, J., Sauciuc, I., Narasimhan, S., Chau, D., Chrysler, G., Myers, A., Prstic, S. and Hu, C., "Nano and Micro Technology-Based Next-Generation Package-Level Cooling Solutions: Potentials and Challenges," Intel Technology Journal, Dec. 2005.