Room-temperature cu microjoining with ultrasonic bonding of cone-shaped bump

Japanese Journal of Applied Physics

Volumn 52, Issue 4 PART 2, 2013, Pages

  Qiu, Lijing ^a   Ikeda, Akihiro ^a   Noda, Kazuhiro ^b   Nakai, Seiya ^b   Asano, Tanemasa ^a  

^a KYUSHU UNIVERSITY   (Japan)

^b Adwelds Co Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSION FORCE; COUNTER ELECTRODES; ELECTRICAL CHARACTERIZATION; MECHANICAL CHARACTERIZATIONS; THICKNESS DEPENDENCE; ULTRASONIC BONDING; ULTRASONIC VIBRATION; VIBRATION AMPLITUDE;

DIFFUSION BONDING; SOLID STATE DEVICES; SURFACE ROUGHNESS;

VIBRATIONS (MECHANICAL);

EID: 84880848517     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.7567/JJAP.52.04CB10     Document Type: Conference Paper

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