A microstructural study of dislocation substructures formed in metal foil substrates during ultrasonic wire bonding

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 28, Issue 12, 1997, Pages 2663-2671

  Murdeshwar, Nikhil ^a,b   Krzanowski, James E ^c  

^a UNIVERSITY OF NEW HAMPSHIRE   (United States)

^b IBM   (United States)

^c Univ of New Hampshire   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; BONDING; BRONZE; COPPER; CRYSTAL MICROSTRUCTURE; DEFORMATION; DISLOCATIONS (CRYSTALS); NICKEL; STACKING FAULTS; STAINLESS STEEL; THERMAL EFFECTS; ULTRASONIC APPLICATIONS;

STACKING FAULT ENERGY (SFE); ULTRASONIC WIRE BONDING (UWB);

METAL FOIL;

EID: 0031352975     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-997-0023-8     Document Type: Article

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