The law of ultrasonic energy conversion in thermosonic flip chip bonding interfaces

Microelectronic Engineering

Volumn 86, Issue 10, 2009, Pages 2063-2066

  Junhui, Li ^a,b,c   Ruishan, Wang ^a,b   Hu, He ^a,b   Fuliang, Wang ^a,b   Lei, Han ^a,b   Jue, Zhong ^a,b  

^a CENTRAL SOUTH UNIVERSITY   (China)

^b BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS   (China)

^c State Key Laboratory of Digital Manufacturing Equipment and Technology   (China)

Author keywords

Diffusion; Dynamics; Flip Chip

Indexed keywords

ATOM DIFFUSION; BONDING PROCESS; EXPERIMENTAL EVALUATION; FC BONDING; FLIP CHIP; FLIP CHIP BONDING; HIGH-RESOLUTION TRANSMISSION ELECTRON MICROSCOPES; LASER DOPPLER VIBROMETER; THERMOSONIC FLIP-CHIP BONDING; VERTICAL SECTION; VIBRATION CHARACTERISTICS; VIBRATION VELOCITY;

ATOMS; DYNAMICS; ENERGY CONVERSION; LASER DOPPLER VELOCIMETERS; LAWS AND LEGISLATION; METALLIC COMPOUNDS; TRANSMISSION ELECTRON MICROSCOPY; ULTRASONICS;

DIFFUSION IN SOLIDS;

EID: 67649933217     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.01.058     Document Type: Article

References (13)

1. Li J., Han L., Duan J., and Zhong J. Applied Physics Letters 90 (2007) 242902
2. Li J., Han L., and Zhong J. Materials Chemistry and Physics 106 2-3 (2007) 457-460
3. Han L., Gao R., Zhong J., and Li H. Sensors and Actuators A 137 (2007) 41-50
4. Li J., Han L., and Zhong J. Surface and Interface Analysis 40 5 (2008) 953-957
5. Li J., Fuliang W., Han L., and Zhong J. Journal of Physics D: Applied Physics 41 (2008) 135303
6. Jun-Hui L., Fu-liang W., Lei H., and Jue Z. Transactions of Nonferrous Metals Society of China 16 2 (2006) 463-466
7. Jun-Hui L., Lei H., and Jue Z. Transactions of Nonferrous Metals Society of China 15 4 (2005) 846-850
8. Han L., Wang F., Xu W., and Zhong J. Microelectronics Reliability 46 (2006) 610-615
9. Han L., Zhong J., and Gao R. Sensors and Actuators A 141 (2008) 695-702
10. Duan J.-a., Li J., Han L., and Zhong J. Surface and Interface Analysis 39 (2007) 783-786
11. Jun-Hui L., Ji-an D., Lei H., and Jue Z. Materials Characterization 58 (2007) 103-107
12. Li J., Han L., and Zhong J. IEEE Transactions on Advanced Packaging 31 3 (2008) 442-446
13. Jun-Hui L., Lei H., and Jue Z. Journal of Central South University of Technology 15 (2008) 684-688