Investigation on the high frequency thermosonic flip chip bonding under low temperature

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 376-379

  Pang, C C H ^a   Sham, M L ^a,b   Hung, K Y ^a  

^a ASM Assembly Automation Ltd   (Hong Kong)

^b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; DEFORMATION; DIES; FLIP CHIP DEVICES; SHEAR FLOW; TEMPERATURE;

BONDING MECHANISM; BONDING TEMPERATURES; FLIP-CHIP PACKAGES; HIGH FREQUENCY HF; LOW TEMPERATURES; STAND OFF HEIGHT; THERMO-SONIC BONDING; THERMOSONIC FLIP-CHIP BONDING;

ELECTRONICS PACKAGING;

EID: 84954062918     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271549     Document Type: Conference Paper

References (3)

1. nd edition, 1997, Chap. 8
2. rd ECTC, 1993
3. L.K. Cheah, Y.M. Tan, J. Wei and C. K. Wong, "Gold to Gold Thermosonic Flip Chip Bonding", Proceedings HDI 2001, April, 2001, pp.165-175