Grains, deformation substructures, and slip bands observed in thermosonic copper ball bonding

Materials Characterization

Volumn 50, Issue 1, 2003, Pages 39-50

  Murali, S ^a   Srikanth, N ^a   Vath III, Charles J ^a  

^a ASM Technology Singapore Pte Ltd   (Singapore)

Author keywords

Columnar grains; Copper ball bonding; Deformation substructures; Slip bands; Ultrasonic wire bonding

Indexed keywords

BONDING; DEFORMATION; GRAIN SIZE AND SHAPE; MICROHARDNESS;

SLIP BANDS;

COPPER;

EID: 0141818972     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1044-5803(03)00102-5     Document Type: Article

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