Thermosonic flip-chip bonding for SAW filter

Microelectronics Reliability

Volumn 44, Issue 1, 2004, Pages 149-154

  Tomioka, Taizo ^a   Iguchi, Tomohiro ^a   Mori, Ikuo ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; BOND STRENGTH (CHEMICAL); BONDING; DEFORMATION; ELECTRODES; FLIP CHIP DEVICES; GOLD PLATING; OPTIMIZATION; RELIABILITY; RESINS; SHEAR STRENGTH; SUBSTRATES; ULTRASONICS;

FLIP CHIP BONDING (FCB); THERMOSONIC BONDING;

ACOUSTIC SURFACE WAVE FILTERS;

EID: 0346781566     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2003.09.004     Document Type: Article

References (8)

1. Hikita M, Tabuchi T, et al., Low loss SAW filter for antenna duplexer. In: Proceedings of the IEEE 1983 Ultrasonic Symposium, 1983. p. 77-82.
2. Ikata O, Miyashita T, et al., Development of low-loss band-pass SAW filters using SAW resonators for portable telephones. In: Proceedings of the IEEE 1992 Ultrasonic Symposium, 1992. p. 111-15.
3. Yatsuda H. Eimura T. Flip-chip assembly technique for SAW devices. In: Proceedings of the 1995 ISHM International Symposium on Microelectronics, 1995. p. 365-70.
4. FUJITSU Corporation, http://pr.fujitsu.com/jp/news/1997/Dec/4.html.
5. TOSHIBA Corporation, http://www.toshiba.co.jp/tech/review/1998/03/c05/index_j.htm.
6. MURATA Manufacturing Co Ltd, http://www.murata.co.jp/articles/01b1.html.
7. Shibata M, Iguchi T, Aizawa T. High-speed thermosonic flip chip bonder for small and low-pin-count devices. Available from: http://www.toshiba.co.jp/tech/review/2002/08/57_08pdf/f02.pdf.
8. Yamamoto H., Iwata S., et al. JEMS. 10(1):1977;4-11.