Kinetics in Nanoscale Materials

Kinetics in Nanoscale Materials

Volumn 9780470881408, Issue , 2014, Pages 1-296

  Tu, King Ning ^a   Gusak, Andriy M ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b CHERKASY NATIONAL UNIVERSITY   (Ukraine)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; KINETICS; MELTING POINT; METALLURGY; NANOSTRUCTURED MATERIALS; NANOTECHNOLOGY; SOLID STATE REACTIONS; STUDENTS; TEXTBOOKS;

CAMBRIDGE UNIVERSITY; FIRST-YEAR GRADUATES; MATERIALS SCIENCE AND ENGINEERING; MORPHOLOGICAL INSTABILITY; NANO-SCALE MATERIALS; NANO-SIZE PARTICLES; THIN FILM RELIABILITY; UNDERGRADUATE STUDENTS;

THIN FILMS;

EID: 84879881110     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1002/9781118743140     Document Type: Book

References (149)

1. Mullins WW, Sekerka RF. Stability of a planar interface during solidification of a dilute binary alloy. Journal of Applied Physics 1964;35:444-451.
2. Fleming MC. Solidification Processing. New York: McGraw-Hill; 1974.
3. Yin Y, Rioux RM, Endonmez CK, Hughes S, Somorjai GA, Alivisatos AP. Formation of hollow nanocrystals through the nanoscale Kirkendall effect. Science 2004;304:711-714.
4. Smigelkas AD, Kirkendall EO. Zinc diffusion in alpha brass. Trans AIME 1947;171:130-142.
5. Tu KN, Goesele U. Hollow nanostructures based on the Kirkendall effect: design and stability considerations. Appl Phys Lett 2005;86:093111-1-093111-3.
6. Gusak AM, Zaporozhets TV, Tu KN, Goesele U. Kinetic analysis of the instability of hollow nanoparticles. Philos Mag 2005;85(36):4445-4464.
7. Gusak AM, Tu KN. Interaction between Kirkendall effect and inverse Kirkendall effect in nanoscale particles. Acta Mater 2009;57:3367-3373.
8. Gusak AM, Zaporozhets TV. Hollow nanoshell formation and collapse in binary solid solutions with large range of solubility. J Phys Condens Mat 2009;21:415303-415313.
9. Patolsky F, Timko BP, Zhang G, Lieber CM. Nanowire-based nanoelectronic devices in the life sciences. MRS Bull 2007;32:142-149.
10. Huang Y, Duan XF, Cui Y, Lauhon LJ, Kim KH, Lieber CM. Logic gates and computation from assembled nanowire building blocks. Science 2001;294:1313-1317.
11. Lu K-C, Tu KN, Wu WW, Chen LJ, Yoo B-Y, Myung NV. Point contact reactions between Ni and Si nanowires and reactive epitaxial growth of axial nano-NiSi/Si. Appl Phys Lett 2007;90:253111-253111-3.
12. Lu K-C,Wu W-W,Wu H-W, Tanner CM, Chang JP, Chen LJ, Tu KN. In-situ control of atomic-scale Si layer with huge strain in the nano-heterostructure NiSi/Si/NiSi through point contact reaction. Nano Lett 2007;7(8):2389-2394.
13. Tang W, Dayeh SA, Picraux ST, Huang JY, Tu KN. Ultrashort channel silicon nanowire transistors with nickel silicide source/drain contacts. Nano Lett 2012;12:3979-3985.
14. Chan CK, Peng H, Liu G, McIlwrath K, Zhang XF, Huggins RA, Cui Y. High performance lithium battery anodes using silicon nanowires. Nat Nanotechnol 2008;3:31-35.
15. Liu XH, Wang JW, Huang S, Fan F, Huang X, Liu Y, Krylyuk S, Yoo J, Dayeh SA, Davydov AV, Mao SX, Picraux ST, Zhang S, Li J, Zhu T, Huang JY. In situ atomic scale imaging of electrochemical lithiation in silicon. Nat Technol 2012;7:749-756.
16. Herd S, Tu KN, Ahn KY. Formation of an amorphous Rh-Si alloy by interfacial reaction between amorphous Si and crystalline Rh thin films. Appl Phys Lett 1983;42:597-599.
17. Lee J-Y, Connor ST, Cui Y, Peumans P. Solution-processed metal nanowire mesh transparent electrodes. Nano Lett 2008;8:689-692.
18. Garnett EC, Cai W, Cha JJ, Mahmood F, Connor ST, Greyson Christoforo M, Cui Y, McGehee MD, Brongersma ML. Self-limited plasmonic welding of silver nanowire junctions. Nat Mater 2012;11:241-249.
19. Tu KN, Yeh CC, Liu CY, Chen C. Effect of current crowding on vacancy diffusion and void formation in electromigration. Appl Phys Lett 2000;76:988-990.
20. Ma E, Thompson CV, Clevenger LA, Tu KN. Self- propagating explosive reaction in Al/Ni multilayer thin films. Appl Phys Lett 1990;57:1262-1264.
21. Clevenger LA, Thompson CV, Tu KN. Explosive silicidation in nickel/amorphous-silicon multilayer thin films. J Appl Phys 1990;67:2894-2898.
22. De Avillez RR, Clevenger LA, Thompson CV, Tu KN. Quantitative investigation of Ti/amorphous-Si multilayer thin film reactions. J Mater Res 1990;5:593-600.
23. Tong M, Sturgess D, Tu KN, Yang J-M. Explosively reacting nanolayers as localized heat sources in solder joints - a microstructural analysis. Appl Phys Lett 2008;92:144101-144101-3.
24. Lu L, Shen YF, Chen XH, Qian LK, Lu K. Ultrahigh strength and high electrical conductivity in copper. Science 2004;304:422-426.
25. Xu D, Kwan WL, Chen K, Zhang X, Ozolins V, Tu KN. Nanotwin formation in copper thin films by stress/strain relaxation in pulse electrodeposition. Appl Phys Lett 2007;91:254105-254105-3.
26. Lu J, Lu K. Chapter 14: Surface nanocrystallization (SNC) of materials and its effect on mechanical behavior. In: Comprehensive Structure Integrity. Vol. 8. 2003. p 495-528.
27. Tong WP, Tao NR, Wang ZB, Lu J, Lu K. Nitriding iron at lower temperature. Science 2003;299:686-688.
28. Wang ZB, Tao NR, Tong WP, Lu J, Lu K. Diffusion of chromium in nanocrystalline iron produced by means of surface mechanical attrition treatment. Acta Mater 2003;51:4319-4329.
29. Crank J. Mathematics of Diffusion. Fair Lawn, NJ: Oxford University Press; 1956.
30. Shewmon PG. Diffusion in Solids. 2nd ed.Warrendale, PA: The Minerals, Metals, and Materials Society; 1989.
31. Glicksman ME. Diffusion in Solids. New York: Wiley-Interscience; 2000.
32. Balluffi RW, Allen SM, Carter WC. Kinetics of Materials. New York: Wiley-Interscience; 2005.
33. Gupta D, Ho PS, editors. Diffusion Phenomena in Thin Films and Micro-Electronic Materials. Park Ridge, NJ: Noyes Publications; 1988.
34. Cahn JW. On spinodal decomposition. Acta Metall 1961;9:795-801.
35. Hillert M, A solid-solution model for inhomogeneous systems. Acta Metall 1961; 6:525-535.
36. Cahn JW, Hilliard JE. Free energy of a nonuniform system. I: interfacial free energy. J Chem Phys 1958;28:258-267.
37. Cahn JW, Hilliard JE. Free energy of a nonuniform system. III: nucleation in a two-component incompressible fluid. J Chem Phys 1959;31:688-699.
38. Cahn JW, Hilliard JE. Spinodal decomposition: a reprise. Acta Metall 1971;19:151-161.
39. Tu KN. Interdiffusion in thin films. In: Huggins RA, editor. Annual Review of Materials Science. Vol. 15. Palo Alto: Annual Reviews Inc.; 1985. p 147.
40. Smigelkas AD, Kirkendall EO. Zinc diffusion in alpha brass. Trans AIME 1947;171:130-142.
41. Darken LS. Diffusion, mobility and their interrelation through free energy in binary metallic systems. Trans AIME 1948;175:184-201.
42. Hoglund L, Agren J. Analysis of the Kirkendall effect, marker migration and pore formation. Acta Mater 2001;49:1311-1317.
43. Strandlund H, Larsson H. Prediction of Kirkendall shift and porosity in binary and ternary diffusion couples. Acta Mater 2004;52:4695-4703.
44. Yin Y, Rioux RM, Erdonmez CK, Hughes S, Somorjai GA, Alivisatos AP. Formation of hollow nanocrystals through the nanoscale Kirkendall effect. Science 2004;304:711-714.
45. Tu KN, Gösele U. Hollow nanostructures based on the Kirkendall effect: design and stability considerations. Appl Phys Lett 2005;86:093111-093111-3.
46. Gusak AM, Zaporozhets TV, Tu KN, Goesele U. Kinetic analysis of the instability of hollow nanoparticles. Philos Mag 2005;85:4445-4464.
47. Yin Y, Erdonmez CK, Cabot A, Hughes S, Alivisatos AP. Colloidal synthesis of hollow cobalt sulfide nanocrystals. Adv Funct Mater 2006;16:1389-1399.
48. Marwick AD. Segregation in irradiated alloys: the inverse Kirkendall effect and the effect of constitution on void swelling. J Phys F 1978;8:1849-1861.
49. Gusak AM, Tu KN. Interaction between Kirkendall effect and inverse Kirkendall effect in nanoscale particles. Acta Mater 2009;57:3367-3373.
50. Lifshitz IM, Slyozov VV. The kinetics of precipitation from supersaturated solid solutions. J Phys Chem Solids 1961;19:35-50.
51. Wagner C. Theorie der Alterung von Niederschlägen durch Umlösen (Ostwald-Reifung). Z Elektrochem 1961;65:581-591.
52. Ham FS. Theory of diffusion-limited precipitation. J Phys Chem Solids 1958;6:335-351.
53. Shewmon P. Diffusion in Solids. 2nd ed. Warrendale (PA): TMS; 1989.
54. Voorhees PW. The theory of Ostwald ripening. J Stat Phys 1985;38:231-252.
55. Voorhees PW. Ostwald ripening of two-phase mixtures. Annu Rev Mater Sci 1992;22:197-215.
56. Ardell AJ, Nicholson RB. Coarsening in Ni-Al systems. J Chem Phys Solids 1966;27:1793-1794.
57. Ardell AJ. In: Lorimer GW, editor. Phase Transformations 87. London: Institute of Metals; 1988. 485-494.
58. Gusak AM, Tu KN. Kinetic theory of flux-driven ripening. Phys Rev B 2002;66:115403-1-115403-14.
59. Hilliard JEChapter 12 on. Spinodal decomposition. In: Aaronson HI, editor. Phase Transformations. Metals Park, Ohio: ASM; 1968. p 497-560.
60. Hillert M. A solid-solution model for inhomogeneous systems. Acta Metall 1961;9:525-535.
61. Cahn JW. On spinodal decomposition. Acta Metall 1961;9:795-801.
62. Cahn JW, Hilliard JE. Free energy of a nonuniform system I: interfacial free energy. J Chem Phys 1958;28:258-267.
63. Cahn JW, Hilliard JE. Free energy of a non-uniform system III: nucleation in a two-component incompressible fluid. J Chem Phys 1959;31:688-699.
64. Cahn JW, Hilliard JE. Spinodal decomposition: a reprise. Acta Metall 1971;19:151-161.
65. Cook HE, Hilliard JE. Effect of gradient energy on diffusion in gold-silver alloys. J Appl Phys 1969;20:2191-2198.
66. Cook HE, deFontaine D, Hilliard JE. A model for diffusion on cubic lattices and its application to the early stages of ordering. Acta Metall 1969;17:765-773.
67. Greer AL, Spaepen F. In: Chang LL, Giessen BC, editors. Synthetic Modulated Structures. Vol. 11. Orlando: Academic Press; 1985. p 419-486.
68. Porter DA, Easterling KE. Phase Transformations in Metals and Alloys. 2nd ed. London: Chapman and Hall; 1992.
69. Christian JW. The Theory of Transformations in Metals and Alloys. 2nd ed. Oxford: Pergamon Press; 1975.
70. Aaranson HI, editor. Phase Transformations. Ohio: ASM Metals Park; 1970.
71. Tu KN, Turnbull D. Morphology of cellular precipitation of tin from lead-tin bicrystals. Acta Met 1967;15:369.
72. Tu KN, Turnbull D. Morphology of cellular precipitation of tin from lead-tin bicrystals-II. Acta Met 1967;15:1317.
73. Cahn JW. The kinetics of cellular segregation reactions. Acta Met 1959;7:18-28.
74. Chou Y-C, Wu W-W, Cheng S-L, Yoo B-Y, Myung N, Chen LJ, Tu KN. In situ TEM observation of repeating events of nucleation in epitaxial growth of nano CoSi2 in nanowires of Si. Nano Lett 2008;8:2194-2199.
75. Chou Y-C, Wu WW, Chen LJ, Tu KN. Homogeneous nucleation of epitaxial CoSi2 and NiSi in Si nanowires. Nano Lett 2009;9:2337-2342.
76. Chou Y-C, Wu W-W, Lee C-Y, Chen LJ, Tu KN. Heterogeneous and homogeneous nucleation of epitaxial NiSi2 in [110] Si nanowires. J Phys Chem C 2011;115:397-401.
77. Tu KN, Mayer JW, Feldman LC. Electronic Thin Film Science. New York: MacMillan; 1992.
78. Tu KN. Electronic Thin Film Reliability. Cambridge, UK: Cambridge University Press; 2011.
79. Mayer JW, Poate JM, Tu KN. Thin films and solid-phase reactions. Science 1975;190:228-234.
80. Tu KN, Mayer JW. Silicide formation Chapter 10. In: Poate JM, Tu KN, Mayer JW, editors. Thin Films: Interdiffusion and Reactions. New York: Wiley-Interscience; 1978.
81. Nicolet M-A, Lau SS. Formation and characterization of transition-metal silicides. In: Einspruch NG, Larrabee GB, editors. VLSI Electronics. Vol. 6. New York: Academic Press; 1983. For standard heat of formation of transition metal silicides and oxides, see Table A.X.
82. Chen LJ, Tu KN. Epitaxial growth of transition-metal silicides on silicon. Mater Sci Rep 1991;6:53-140.
83. Chen SH, Zheng LR, Carter CB, Mayer JW. Transmission electron microscopy studies on the lateral growth of nickel silicides. J Appl Phys 1985;57:258.
84. Kidson GV. Some aspects of the growth of diffusion layers in binary systems. J Nucl Mater 1961;3:21-29.
85. Pretorius R, Harris JM, Nicolet M-A. Reaction of thin metal films with SiO2 substrates. Solid State Electron 1978;21:667-675.
86. Goesele U, Tu KN. Growth kinetics of planar binary diffusion couples: thin film case versus bulk cases. J Appl Phys 1982;53:3252-3260.
87. Tu KN. Selective growth of metal-rich silicide of near-noble metals. Appl Phys Lett 1975;27:221-224.
88. Foell H, Ho PS, Tu KN. Cross-sectional TEM of silicon-silicide interfaces. J Appl Phys 1981;52:250-255.
89. Tung RT. Schottky barrier formation at single crystal metal-semiconductor interfaces. Phys Rev Lett 1984;52:461-464.
90. Cui Y, Lieber CM. Functional nanoscale electronic devices assembled using silicon nanowire building blocks. Science 2001;291:851-853.
91. Patolsky F, Timko BP, Zheng G, Lieber CM. Nanowire based nanoelectronic devices in life science. MRS Bull 2007;32:142-149.
92. Lu K-C,Wu W-W,Wu H-W, Tanner CM, Chang JP, Chen LJ, Tu KN. In-situ control of atomic-scale Si layer with huge strain in the nano-heterostructure NiSi/Si/NiSi through point contact reaction. Nano Lett 2007;7(8):2389-2394.
93. Chou YC, Wu WW, Chen LJ, Tu KN. Homogeneous nucleation of epitaxial CoSi2 and NiSi in Si nanowires. Nano Lett 2009;9:2337-2342.
94. Lin Y-C, Kuo-Chang L, Wen-Wei W, Bai J, Chen LJ, Tu KN, Huang Y. Single crystalline PtSi nanowires, PtSi/Si/PtSi nanowire heterostructures, and nanodevices. Nano Lett 2008;8:913-918.
95. Lu K-C, Wu W-W, Ouyang H, Lin Y-C, Huang Y, Wang C-W, Wu Z-W, Huang C-W, Chen L-J, Tu KN. The influence of surface oxide on the growth of metal/semiconductor nanowires. Nano Lett 2011;11(7):2753-2758.
96. Burke JE, Turnbull D. Recrystallization and grain growth. Progr Met Phys 1952;3:220-292.
97. Hillert M. On the theory of normal and abnormal grain growth. Acta Metall 1956;13(3):227-238.
98. http://en.wikipedia.org/wiki/Avrami_equation. Accessed 2014 Jan 24.
99. Kolmogorov A. H. About statistical theory of metals crystallization. Isvestiya Akdemii Nauk, mathematics, 1937;1(3):355-359.
100. Avrami M. Kinetics of phase change. I. General theory. J Chem Phys 1939;7(12):1103-1112.
101. Avrami M. Kinetics of phase change. II. Transformation-time relations for random distribution of nuclei. J Chem Phys 1940;8(2):212-224.
102. Avrami M. Kinetics of phase change. III. Granulation, phase change, and microstructure. J Chem Phys 1941;9(2):177-184.
103. Johnson WA, Mehl RF. Reaction kinetics in processes of nucleation and growth. Trans AIME 1939;135:416.
104. Cahn JW. Transformation kinetics during continuous cooling. Acta Metall 1956;4(6):572-575.
105. Holm EA, Glazier JA, Srolovitz DJ, Grest GS. Effects of lattice anisotropy and temperature on domain growth in the two dimensional potts model. Phys Rev A 1991;43:2662-2668.
106. Mullins WW. Two dimensional motion of idealized grain boundaries. J Appl Phys 1956;27:900-904.
107. Stavans J. The evolution of cellular structures. Rep Prog Phys 1993;56:733-789.
108. Thompson CV. Grain growth in thin films. Annu Rev of Mater Sci 1990;20:245-268.
109. Fayad W, Thompson CV, Frost HJ. Steady state grain size distributions resulting from grain growth in two dimensions. Scr Mater 1999;40:1199-1205.
110. Thompson CV. Grain growth and evolution of other cellular structures. Solid State Phys(Academic Press) 2000;55:269-314.
111. Carpenter DT, Codner JR, Barmak K, Rickman JM. Issues associated with the analysis and acquisition of thin film grain size data. Mater Lett 1999;41:296-302.
112. Marder M. Soap-bubble growth. Phys Rev A 1987;36:438-440.
113. Luoat NP. On the theory of normal grain growth. Acta Metall 1974;22:721-724.
114. Louat NP, Duesbery MS, Sadananda K. On the role of random walk in normal grain growth. Mater Sci Forum 1992;94-96:67-76.
115. Pande CS. On a stochastic theory of grain growth. Acta Metall 1987;35:2671-2678.
116. Pande CS. Stochastic theory of grain growth. Mater Sci Forum 1992;94-96:351-360.
117. Gusak AM, Tu KN. Theory of normal grain growth in normalized size space. Acta Materialia 2003;51:3895-3904.
118. Di Nunzio PE. A discrete approach to grain growth based on pair interactions. Acta Mater 2001;49:3635-3643.
119. Lucke K, Abruzzese G, Heckelmann I. Statistical theory of 2-D grain growth based on first principles and its topological foundation. Mater Sci Forum 1992;94-96:3-16.
120. Mullins WW. Grain growth of uniform boundaries with Scaling. Acta Mater 1998;46:6219-6226.
121. Lifshiz IM, Slezov VV. The kinetics of diffusive decomposition of oversaturated solid solutions. Sov JETP 1958;35:479-492.
122. Wagner C. Theorie der altrung von niederschlagen durch umblosen (Ostwald-Reinfund). Z Electrochem 1961;65:581-591.
123. Moldavan D, Wolf D, Philipot SR. A discrete approach to grain growth based on pair interactions. Acta Mater 2001;49:3521-3535.
124. Wu AT, Gusak AM, Tu KN, Kao CR. Electromigration-induced grain rotation in anisotropic conducting beta tin. Appl Phys Lett 2005;86:241902-241903.
125. Ma E, Thompson CV, Clevenger LA, Tu KN. Self-propagating explosive reaction in Al/Ni multilayer thin films. Appl Phys Lett 1990;57:1262-1264.
126. Floro JA. Propagation of explosive crystallization in thin Rh-Si multilayer films. J Vac Sci Technol A 1986;4:631-636.
127. Clevenger LA, Thompson CV, Tu KN. Explosive silicidation in nickel/amorphous-silicon multilayer thin films. J Appl Phys 1990;67:2894-2898.
128. Wickersham CE, Poole JE. Explosive crystallization in Zr/Si multilayers. J Vac Sci Technol A 1988;6:1699-1702.
129. De Avillez RR, Clevenger LA, Thompson CV, Tu KN. Quantitative investigation of Ti/amorphous-Si multilayer thin film reactions. J Mater Res 1990;5:593-600.
130. Weihs TP. Handbooks of Thin Film Process Technology. Bristol, UK: Institute of Physics; 1998.
131. Gavens AJ, Heerden DV, Mann AB, Reiss ME, Weihs TP. Effect of intermixing on self-propagating exothermic reactions in Al/Ni nanolaminate foils. J Appl Phys 2000;87:1255-1263.
132. Wang J, Besnoin E, Knio OM, Weihs TP. Investigating the effect of applied pressure on reactive multilayer foil joining. Acta Mater 2004;52:5265-5274.
133. Tong M, Sturgess D, Tu KN, Yang J-M. Explosively reacting nanolayers as localized heat sources in solder joints - a microstructural analysis. Appl Phys Lett 2008;92:144101-144103.
134. Colgan EG, Nastasi M, Mayer JW. Initial phase formation and dissociation in the thin-film Ni/Al system. J Appl Phys 1985;58:4125-4129.
135. Herd S, Tu KN, Ahn KY. Formation of an amorphous Rh-Si alloy by interfacial reaction between amorphous Si and crystalline Rh thin films. Appl Phys Lett 1983;42:597-599.
136. Lu L, Shen Y, Chen X, Qian L, Lu K. Ultrahigh strength and high electrical conductivity in copper. Science 2004;304:422-426.
137. Lu L, Chen X, Huang X, Lu K. Revealing the maximum strength in nanotwinned copper. Science 2009;323:607-610.
138. Xu D, Kwan WL, Chen K, Zhang X, Ozolins V, Tu KN. Nanotwin formation in copper thin films by stress/strain relaxation in pulse electrodeposition. Appl Phys Lett 2007;91:254105.
139. Xu D, Sriram V, Ozolins V, Yang J-M, Tu KN, Stafford GR, Beauchamp C. In situ measurements of stress evolution for nanotwin formation during pulse electrodeposition of copper. J Appl Phys 2009;105:023521-023526.
140. Xu L, Dixit P, Miao J, Pang JHL, Zhang X, Tu KN. Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins. Appl Phys Lett 2007;90:033111.
141. Anderoglu O, Misra A, Wang H, Ronning F, Hundley MF, Zhang X. Epitaxial nanotwinned Cu films with high strength and high conductivity. Appl Phys Lett 2008;93:083108.
142. Anderoglu O, Misra A, Wang H, Zhang X. Thermal stability of sputtered Cu films with nanoscale growth twins. J Appl Phys 2008;103:094322.
143. Minhua L, Shih D-Y, Lauro P, Goldsmith C, Henderson DW. Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders. Appl Phys Lett 2008;92 (211909).
144. Yeh DC, Huntington HB. Extremely fast diffusion system - nickel in single crystal tin. Phys Rev Lett 1984;53:1469-1472.
145. Dyson BF, Anthony TR, Turnbull D. Interstitial diffusion of Cu in tin. J Appl Phys 1967;38:3408.
146. Suh J-O, Tu KN, Tamura N. Dramatic morphological change of scallop-type Cu6Sn5 formed on (001) single crystal copper in reaction between molten SnPb solder and Cu. Appl Phys Lett 2007;91:051907.
147. Zou HF, Yang HJ, Zhang ZF. Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals. Acta Mater 2008;56:2649-2662.
148. Hsiao H-Y, Liu C-M, Lin H-W, Liu T-C, Lu C-L, Huang Y-S, Chen C, Tu KN. Unidirectional growth of microbumps on (111)-oriented and nanotwinned copper. Science 2012;336:1007-1010.
149. Chen K-C, Wu W-W, Liao C-N, Chen L-J, Tu KN. Observation of atomic diffusion at twin-modified grain boundaries in copper. Science 2008;321:1066-1069.