Investigating the effect of applied pressure on reactive multilayer foil joining

Acta Materialia

Volumn 52, Issue 18, 2004, Pages 5265-5274

  Wang, J ^a   Besnoin, E ^b   Knio, O M ^b   Weihs, T P ^a  

^a Johns Hopkins University   (United States)

^b JOHNS HOPKINS UNIVERSITY   (United States)

Author keywords

Pressure; Solder; Reactive joining; Strength

Indexed keywords

BONDING; MELTING; MOLTEN MATERIALS; OPTICAL FIBERS; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SOLDERING; STAINLESS STEEL; SUBSTRATES; SURFACE TENSION; THERMAL EXPANSION; THICKNESS MEASUREMENT; VISCOSITY; WETTING; X RAY DIFFRACTION ANALYSIS;

APPLIED PRESSURES; FOIL THICKNESS; REACTIVE JOINING; STRENGTH;

METAL FOIL;

EID: 4544322755     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2004.07.012     Document Type: Article

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