High-temperature stable Au-Sn and Cu-Sn interconnects for 3D stacked applications: Advanced processes and materials

NATO Science for Peace and Security Series B: Physics and Biophysics

Volumn , Issue , 2010, Pages 179-190

  Hoivik, Nils ^a   Liu, He ^a   Wang, Kaiying ^a   Salomonsen, Guttorm ^a   Aasmundtveit, Knut ^a  

^a UNIVERSITY OF SOUTH EASTERN NORWAY   (Norway)

Author keywords

3D integration; MEMS; SLID bonding; Wafer bonding; Wafer level packaging

Indexed keywords

EID: 77949484329     PISSN: 18746500     EISSN: None     Source Type: Book Series    
DOI: 10.1007/978-90-481-3807-4_14     Document Type: Article

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