New model for low-temperature oxidation of copper single crystal

Applied Surface Science

Volumn 276, Issue , 2013, Pages 347-358

  Fujita, Kensuke ^a   Ando, Daisuke ^a   Uchikoshi, Masahito ^a   Mimura, Kouji ^a   Isshiki, Minoru ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Copper; Ellipsometry; Grain growth; Low temperature oxidation

Indexed keywords

ACTIVATION ENERGY; COPPER; COPPER OXIDES; ELLIPSOMETRY; GRAIN BOUNDARIES; GROWTH KINETICS; METAL IONS; METALS; OXIDATION; SINGLE CRYSTALS; TEMPERATURE;

COPPER SINGLE CRYSTALS; GRAIN-BOUNDARY DIFFUSION; LOW-TEMPERATURE OXIDATION; OXIDATION RATES; OXIDE LAYER; OXIDE THICKNESS; RATE LAWS; SPECTROSCOPIC ELLIPSOMETERS;

GRAIN GROWTH;

EID: 84877578336     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2013.03.096     Document Type: Article

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