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Volumn 727, Issue , 2002, Pages 25-36
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Mechanical behaviour of nanocrystalline copper related to grain-boundary structure
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Author keywords
[No Author keywords available]
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Indexed keywords
CONDENSATION;
COPPER;
EVAPORATION;
EXTRUSION;
GRAIN BOUNDARIES;
POWDER METALLURGY;
SINTERING;
TENSILE TESTING;
TRANSMISSION ELECTRON MICROSCOPY;
X RAY DIFFRACTION ANALYSIS;
COLD-ISOSTATIC PRESSING;
CRYO-CONDENSATION;
DIFFERENTIAL EXTRUSION;
GEOMETRIC PHASE TECHNIQUE;
LOW ANGLE GRAIN-BOUNDARIES;
NANO-SIZE GRAINS;
NANOSTRUCTURED MATERIALS;
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EID: 0036955773
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-727-r3.2 Document Type: Conference Paper |
Times cited : (2)
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References (19)
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