Kinetic investigation of copper film oxidation by spectroscopic ellipsometry and reflectometry

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 18, Issue 5, 2000, Pages 2527-2532

  Hu, Yao Zhi ^a   Sharangpani, Rahul ^a   Tay, Sing Pin ^a  

^a STEAG RTP Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COPPER; COPPER OXIDES; ELLIPSOMETRY; OXIDATION; REACTION KINETICS; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SCANNING ELECTRON MICROSCOPY; THERMAL EFFECTS; THIN FILMS;

REFLECTOMETRY; SPECTROSCOPIC ELLIPSOMETRY;

METALLIC FILMS;

EID: 0034276297     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1287156     Document Type: Article

References (12)

1. S. Shingubara, K. Fujiki, A. Sano, H. Sakaue, and Y. Horiike, Mater. Res. Soc. Symp. Proc. 338, 441 (1994).
2. J. C. Chuang and M. C. Chen, J. Electrochem. Soc. 145, 4029 (1998).
3. H. K. Liou, J. S. Huang, and K. N. Tu, J. Appl. Phys. 77, 5443 (1995).
4. A. J. Griffin, Jr., S. E. Hernandez, and F. K. Brotzen, J. Electrochem. Soc. 141, 807 (1994).
5. J. C. Chuang and M. C. Chen, Thin Solid Films 322, 213 (1998).
6. Semiconductor Material and Device Characterization, edited by D. K. Schroder (Wiley, New York, 1998).
7. C. G. Ribbing and A. Roos, in Handbook of Optical Constants of Solids II, edited by E. D. Palik (Academic, New York, 1991).
8. J. Li, J. W. Mayer, and E. G. Colgan, J. Appl. Phys. 70, 2820 (1991).
9. A. Ronnquist and H. Fishemister, J. Inst. Met. 89, 651 (1961).
10. N. Cabrera and N. F. Mott, Rep. Prog. Phys. 12, 163 (1948).
11. Y. Z. Hu, Y. Q. Wang, M. Li, J. Joseph, and E. A. Irene, J. Vac. Sci. Technol. A 11, 900 (1993).
12. F. P. Fehlner, J. Electrochem. Soc. 131, 1645 (1984).