Indentation creep of lead-free Sn-3.5Ag solder alloy: Effects of cooling rate and Zn/Sb addition

Materials Science and Engineering: A

Volumn 565, Issue , 2013, Pages 236-242

  Mahmudi, R ^a   Pourmajidian, M ^a   Geranmayeh, A R ^a   Gorgannejad, S ^a   Hashemizadeh, S ^a  

^a UNIVERSITY OF TEHRAN   (Iran)

Author keywords

Hardness; Indentation Creep; Lead free solder; Stress exponent

Indexed keywords

ACTIVATION ENERGY; BINARY ALLOYS; COOLING; CREEP; CREEP RESISTANCE; CREEP TESTING; LEAD ALLOYS; MATERIALS TESTING; SILVER ALLOYS; TERNARY ALLOYS; TIN ALLOYS; ZINC ALLOYS;

ALLOY EFFECT; COOLING RATES; CREEP BEHAVIORS; INDENTATION CREEP; LEAD-FREE; LEAD-FREE SOLDER ALLOY; SN-3.5AG ALLOY; SN-3.5AG SOLDERS; SOLDER ALLOYS; STRESS EXPONENTS;

LEAD-FREE SOLDERS;

EID: 84872145048     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2012.12.048     Document Type: Article

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