SCOPUS 정보 검색 플랫폼

International Journal of Materials Research

Volumn 101, Issue 2, 2010, Pages 271-278

A comparative study of room-temperature creep in lead-free tin-based solder alloys

(2) Mahmudia, R a Geranmayeh, A R b

a UNIVERSITY OF TEHRAN (Iran)

b ISLAMIC AZAD UNIVERSITY (Iran)

Author keywords

Creep; Impression; Indentation; Lead free solder

Indexed keywords

COMPARATIVE STUDIES; CREEP BEHAVIORS; INDENTATION CREEP; LEAD FREE SOLDERS; LEAD-FREE; MICROSTRUCTURAL FEATURES; PURE SN; ROOM TEMPERATURE; SOLDER ALLOYS; STEADY STATE CREEP RATE; STRESS EXPONENTS;

BINARY ALLOYS; CERIUM ALLOYS; COPPER ALLOYS; CREEP; CREEP TESTING; LEAD; MATERIALS TESTING; MICROSTRUCTURAL EVOLUTION; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN; TIN ALLOYS; TITANIUM COMPOUNDS; ZINC;

CREEP RESISTANCE;

EID: 77952624066 PISSN: 18625282 EISSN: None Source Type: Journal
DOI: 10.3139/146.110266 Document Type: Article

Times cited : (11)

References (28)

1
- 10444282137
- DOI:10.1016/j.jallcom.2004.05.055
- D.G. Kim, S.B. Jung: J. Alloys Compd. 386 (2005) 151-156. DOI:10.1016/j.jallcom.2004.05.055
- (2005) J. Alloys Compd. , vol.386 , pp. 151-156
- Kim, D.G.¹ Jung, S.B.²

2
- 0033747819
- DOI:10.1016/S0927-796X(00)00010-3
- M. Abtew, G. Selvaduray: Mater. Sci. Eng. R27 (2000) 95-141. DOI:10.1016/S0927-796X(00)00010-3
- (2000) Mater. Sci. Eng. , vol.27 R , pp. 95-141
- Abtew, M.¹ Selvaduray, G.²

3
- 23244439423
- A.R. Geranmayeh, R. Mahmudi: J. Elec. Mater. 34 (2005) 1002-1009.
- (2005) J. Elec. Mater. , vol.34 , pp. 1002-1009
- Geranmayeh, A.R.¹ Mahmudi, R.²

4
- 0035455208
- N. Wade, K. Wu, J. Kunii, S. Yamada, K. Miyahara: J. Elect. Mater. 30 (2001) 1228-1231.
- (2001) J. Elect. Mater. , vol.30 , pp. 1228-1231
- Wade, N.¹ Wu, K.² Kunii, J.³ Yamada, S.⁴ Miyahara, K.⁵

5
- 21344462667
- Improvement of microstructure and interface structure of eutectic Sn-0.7Cu solder with small amount of Zn addition
- DOI 10.1016/j.scriptamat.2005.05.013, PII S1359646205003155
- F. Wang, X. Ma, Y. Qian: Scr. Mater. 53 (2005) 699-702. DOI:10.1016/j.scriptamat.2005.05.013 (Pubitemid 40908830)
- (2005) Scripta Materialia , vol.53 , Issue.6 , pp. 699-702
- Wang, F.¹ Ma, X.² Qian, Y.³

6
- 84986052291
- H. Rhee, K.N. Subramanian, A. Lee, G. Lee: Solder. Surface Mount Technol. 15 (2003) 21-26.
- (2003) Solder. Surface Mount Technol. , vol.15 , pp. 21-26
- Rhee, H.¹ Subramanian, K.N.² Lee, A.³ Lee, G.⁴

7
- 13944265579
- X. Deng, R.S. Sidhu, P. Johnson, N. Chawala: Metall. Mater. Trans. 36A (2005) 55-64.
- (2005) Metall. Mater. Trans. , vol.36 A , pp. 55-64
- Deng, X.¹ Sidhu, R.S.² Johnson, P.³ Chawala, N.⁴

8
- 51649138888
- DOI:10.1007/BF02653357
- M. McCormack, S. Jin, H.S. Chen: J. Electron. Mater. 23 (1994) 687-690. DOI:10.1007/BF02653357
- (1994) J. Electron. Mater. , vol.23 , pp. 687-690
- McCormack, M.¹ Jin, S.² Chen, H.S.³

9
- 15544376278
- Investigations on microhardness of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder
- DOI 10.1016/j.jallcom.2004.08.079, PII S0925838804012022
- R.A. Islam, B.Y. Wu, M.O. Alam, Y.C. Chan, W. Jillek: J. Alloys Compd. 392 (2005) 149-158. DOI:10.1016/j.jallcom.2004.08.079 (Pubitemid 40402888)
- (2005) Journal of Alloys and Compounds , vol.392 , Issue.1-2 , pp. 149-158
- Islam, R.A.¹ Wu, B.Y.² Alam, M.O.³ Chan, Y.C.⁴ Jillek, W.⁵

10
- 51249167662
- DOI:10.1007/BF02651364
- M. McCormack, S. Jin: J. Electron. Mater. 23 (1994) 715-720. DOI:10.1007/BF02651364
- (1994) J. Electron. Mater. , vol.23 , pp. 715-720
- McCormack, M.¹ Jin, S.²

11
- 0035047957
- Advances in lead-free electronics soldering
- DOI 10.1016/S1359-0286(00)00036-X, PII S135902860000036X
- K. Suganuma: Curr. Opin. Solid State Mater. Sci. 5 (2001) 55-64. DOI:10.1016/S1359-0286(00)00036-X (Pubitemid 32320603)
- (2001) Current Opinion in Solid State and Materials Science , vol.5 , Issue.1 , pp. 55-64
- Suganuma, K.¹

12
- 0032760759
- D. Mitlin, C.H. Raeder, R.W. Messler: Metall. Mater. Trans. A 30 (1999) 115-122.
- (1999) Metall. Mater. Trans. A , vol.30 , pp. 115-122
- Mitlin, D.¹ Raeder, C.H.² Messler, R.W.³

13
- 0032714768
- DOI:10.1007/s11661-999-0200-z
- T. Reinikainen, J. Kivilahti: Metall. Mater. Trans. A 30 (1999) 123-132. DOI:10.1007/s11661-999-0200-z
- (1999) Metall. Mater. Trans. A , vol.30 , pp. 123-132
- Reinikainen, T.¹ Kivilahti, J.²

14
- 34547543065
- Effect of cooling rate on the room-temperature indentation creep of cast lead-free Sn-Bi solder alloys
- DOI 10.1002/pssa.200622583
- R. Mahmudi, A.R. Geranmayeh, S.R. Mahmoodi, A. Khalatbari: Phys. Stat. Sol. (a) 204 (2007) 2302-2308. DOI:10.1002/pssa.200622583 (Pubitemid 47182124)
- (2007) Physica Status Solidi (A) Applications and Materials , vol.204 , Issue.7 , pp. 2302-2308
- Mahmudi, R.¹ Geranmayeh, A.R.² Mahmoodi, S.R.³ Khalatbari, A.⁴

15
- 0037444778
- R.K. Shiue, L.W. Tsay, C.L. Lin, J.L. Ou: J. Mater. Sci. 38 (2003) 1269-1279.
- (2003) J. Mater. Sci. , vol.38 , pp. 1269-1279
- Shiue, R.K.¹ Tsay, L.W.² Lin, C.L.³ Ou, J.L.⁴

16
- 28544442845
- Impression creep technique - An overview
- DOI 10.1016/j.msea.2005.05.110, PII S0921509305007859
- D.H. Sastry, Mater. Sci. Eng. A 409 (2005) 67-75. DOI:10.1016/j.msea. 2005.05.110 (Pubitemid 41742290)
- (2005) Materials Science and Engineering A , vol.409 , Issue.1-2 , pp. 67-75
- Sastry, D.H.¹

17
- 34249782595
- Superplastic power-law creep of Sn-40%Pb-2.5%Sb peritectic alloy
- DOI 10.1007/s10853-006-0187-4
- R. Mahmudi, A. Rezaee-Bazzaz, J. Mater. Sci. 42 (2007) 4051-4059. DOI:10.1007/s10853-006-0187-4 (Pubitemid 46855317)
- (2007) Journal of Materials Science , vol.42 , Issue.11 , pp. 4051-4059
- Mahmudi, R.¹ Rezaee-Bazzaz, A.²

18
- 33846633690
- Investigation of stress exponent in the room-temperature creep of Sn-40Pb-2.5Sb solder alloy
- DOI 10.1016/j.jallcom.2006.04.037, PII S092583880600452X
- R. Mahmudi, A. Rezaee-Bazzaz, H.R. Banaie-Fard: J. Alloy Comp. 429 (2007) 192-197. DOI:10.1016/j.jallcom.2006.04.037 (Pubitemid 46186959)
- (2007) Journal of Alloys and Compounds , vol.429 , Issue.1-2 , pp. 192-197
- Mahmudi, R.¹ Rezaee-Bazzaz, A.² Banaie-Fard, H.R.³

19
- 0022489078
- DOI:10.1007/BF01671427
- A. Juhasz, P. Tasnadi, I. Kovacs: J. Mater. Sci. Lett. 5 (1986) 35-36. DOI:10.1007/BF01671427
- (1986) J. Mater. Sci. Lett. , vol.5 , pp. 35-36
- Juhasz, A.¹ Tasnadi, P.² Kovacs, I.³

20
- 0026899205
- P.M. Sargent, M.F. Ashby: Mater. Sci. Technol. 8 (1992) 594-601.
- (1992) Mater. Sci. Technol. , vol.8 , pp. 594-601
- Sargent, P.M.¹ Ashby, M.F.²

21
- 33846787053
- Impression creep behavior of lead-free Sn-5Sb solder alloy
- DOI 10.1016/j.msea.2006.10.092, PII S0921509306022726
- R. Mahmudi, A.R. Geranmayeh, A. Rezaee-Bazzaz: Mater. Sci. Eng. A448 (2007) 287-293. DOI:10.1016/j.msea.2006.10.092 (Pubitemid 46202182)
- (2007) Materials Science and Engineering A , vol.448 , Issue.1-2 , pp. 287-293
- Mahmudi, R.¹ Geranmayeh, A.R.² Rezaee-Bazzaz, A.³

22
- 28044466720
- M.L. Huang, C.M.L. Wu, L. Wang: J. Elect. Mater. 34 (2005) 1373-1377.
- (2005) J. Elect. Mater. , vol.34 , pp. 1373-1377
- Huang, M.L.¹ Wu, C.M.L.² Wang, L.³

23
- 17244376693
- DOI:10.1007/s11664-005-0218-y
- T. Ogawa, R. Kaga, T. Ohsawa: J. Elec. Mater. 34 (2005) 311-317. DOI:10.1007/s11664-005-0218-y
- (2005) J. Elec. Mater. , vol.34 , pp. 311-317
- Ogawa, T.¹ Kaga, R.² Ohsawa, T.³

24
- 0036611639
- H.G. Song, J.W. Morris, Jr., F. Hua: JOM 54 (2002) 30-32.
- (2002) JOM , vol.54 , pp. 30-32
- Song, H.G.¹ Morris Jr., J.W.² Hua, F.³

25
- 0031192444
- DOI:10.1007/s11664-997-0252-z
- H. Mavoori, J. Chin, S. Vaynman, B. Moran, L. Keer, M. Fine: J. Electron. Mater. 26 (1997) 783-790. DOI:10.1007/s11664-997-0252-z
- (1997) J. Electron. Mater. , vol.26 , pp. 783-790
- Mavoori, H.¹ Chin, J.² Vaynman, S.³ Moran, B.⁴ Keer, L.⁵ Fine, M.⁶

26
- 0036575677
- DOI:10.1007/s11661-002-0075-8
- R.J. McCabe, M.E. Fine: Metall. Mater. Trans. 33A (2002) 1531-1539. DOI:10.1007/s11661-002-0075-8
- (2002) Metall. Mater. Trans. , vol.33 A , pp. 1531-1539
- McCabe, R.J.¹ Fine, M.E.²

27
- 0031187099
- K.L. Murty, F.M. Haggag, R.K. Mahidhara: J. Elec. Mater. 26 (1997) 839-846.
- (1997) J. Elec. Mater. , vol.26 , pp. 839-846
- Murty, K.L.¹ Haggag, F.M.² Mahidhara, R.K.³

28
- 23644445988
- DOI:10.1007/s10853- 005
- A.R. Geranmayeh, R. Mahmudi: J. Mater. Sci. 40 (2005) 3361 - 3366. DOI:10.1007/s10853- 005-0421-425
- (2005) J. Mater. Sci. , vol.40 , Issue.3361-3366 , pp. 0421-425
- Geranmayeh, A.R.¹ Mahmudi, R.²

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.