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Materials Science and Technology

Volumn 24, Issue 4, 2008, Pages 488-494

Effect of Zn addition on steady state creep characteristics of Sn-3·3Ag solder alloy

(5) Fawzy, A a Habib, N a Sobhy, M a Nassr, E a Saad, G a

a Ain Shams University (Egypt)

Author keywords

Aging; Creep; Mechanical properties; Microstructure; Solder alloys

Indexed keywords

ADDITION REACTIONS; CREEP RESISTANCE; MICROSTRUCTURE; THERMAL AGING; THERMAL STRESS; TIN ALLOYS;

AGED ALLOYS; AGING TEMPERATURE; STEADY STATE CREEP CHARACTERISTICS;

SOLDERING ALLOYS;

EID: 44449115554 PISSN: 02670836 EISSN: None Source Type: Journal
DOI: 10.1179/174328408X278457 Document Type: Article

Times cited : (4)

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