Effect of a trace of Cr on intermetallic compound layer for tin-zinc lead-free solder joint during aging

Journal of Alloys and Compounds

Volumn 470, Issue 1-2, 2009, Pages 429-433

  Chen, Xi ^a   Hu, Anmin ^a   Li, Ming ^a   Mao, Dali ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Aging; Lead free solder; Microstructure; Sn Zn

Indexed keywords

BRAZING; CHROMIUM; GROWTH (MATERIALS); INTERMETALLICS; LEAD; LEAD COMPOUNDS; MICROSTRUCTURE; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; TITANIUM COMPOUNDS; WELDING; ZINC;

AGING; AGING TREATMENTS; EXPERIMENTAL DATUM; IMC LAYERS; INTERFACIAL INTERMETALLICS; INTERMETALLIC COMPOUND LAYERS; LEAD-FREE SOLDER; LEAD-FREE SOLDER JOINTS; SN-ZN;

TIN;

EID: 59249100068     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.02.112     Document Type: Article

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