The influence of target erosion on the mass spectra of clusters formed in the planar DC magnetron sputtering source

Surface and Coatings Technology

Volumn 213, Issue , 2012, Pages 41-47

  Ganeva, M ^a   Pipa, A V ^b   Hippler, R ^a  

^a UNIVERSITY OF GREIFSWALD   (Germany)

^b LEIBNIZ INSTITUTE FOR PLASMA SCIENCE AND TECHNOLOGY   (Germany)

Author keywords

Cluster formation; Copper; Gas aggregation; Magnetron sputtering; Nanoclusters

Indexed keywords

ANGULAR DEPENDENCE; CLUSTER FORMATIONS; CLUSTER SIZES; CLUSTER-SIZE DISTRIBUTION; CRUCIAL PARAMETERS; DC MAGNETRON SPUTTERING; FREE METALS; GAS AGGREGATION; GROOVE DEPTH; MASS SPECTRA; OPERATION TIME; QUADRUPOLE MASS FILTERS; SPUTTERING YIELDS; TARGET EROSION;

CLUSTER ANALYSIS; COPPER; MASS SPECTROMETERS; MASS SPECTROMETRY; NANOCLUSTERS; SIZE DISTRIBUTION;

MAGNETRON SPUTTERING;

EID: 84870243543     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2012.10.012     Document Type: Article

References (49)

1. Thornton J.A., Penfold A.S. Thin Film Processes 1978, 24-28:75. Academic Press, Inc., Oval Road, London NW1 7DX. J.L. Vossen, W. Kern (Eds.).
2. Waits R.K. Thin Film Processes 1978, 24-28:131. Academic Press, Inc., Oval Road, London NW1 7DX. J.L. Vossen, W. Kern (Eds.).
3. Popok V.N., Barke I., Campbell E.E., Meiwes-Broer K.-H. Surf. Sci. Rep. 2011, 66:347.
4. Haberland H., Karrais M., Mall M., Thurner Y. J. Vac. Sci. Technol. A 1992, 10:3266.
5. Cioffi N., Torsi L., Ditaranto N., Tantillo G., Ghibelli L., Sabbatini L., Bleve-Zacheo T., D'Alessio M., Zambonin P.G., Traversa E. Chem. Mater. 2005, 17:5255.
6. Ressler T., Kniep B.L., Kasatkin I., Schlögl R. Angew. Chem. Int. Ed. 2005, 44:4704.
7. Vukojevic S., Trapp O., Grunwaldt J.-D., Kiener C., Schüth F. Angew. Chem. Int. Ed. 2005, 44:7978.
8. Milani P., Iannotta S. Cluster Beam Synthesis of Nanostructured Materials 1999, Springer.
9. Clusters of Atoms and Molecules I 1995, Springer Verlag, Berlin Heidelberg. H. Haberland (Ed.).
10. Haberland H., Mall M., Moseler M., Qiang Y., Reiners T., Thurner Y. J. Vac. Sci. Technol. A 1994, 12:2925.
11. Pratontep S., Carroll S.J., Xirouchaki C., Streun M., Palmer R.E. Rev. Sci. Instrum. 2005, 76:045103.
12. De Gryse R., Depla D., Mahieu S., Haemers J. Mater. Technol. Adv. Perform. Mater. 2011, 26:3.
13. Gryse R.D., Haemers J., Leroy W., Depla D. Thin Solid Films 2012, 520:5833.
14. Kukla R., Krug T., Ludwig R., Wilmes K. Vacuum 1990, 41:1968.
15. C.B. Garrett, 1984. US Patent No 4 444 643.
16. Musil J., Vlcek J., Baroch P. Materials Surface Processing by Directed Energy Techniques 2006, 67. Elsevier. Y. Pauleau (Ed.).
17. Bräuer G., Szyszka B., Vergöhl M., Bandorf R. Vacuum 2010, 84:1354.
18. Welzel T., Ellmer K. Surf. Coat. Technol. 2011, 205(Supplement 2):S294.
19. Chapman B. Glow Discharge Processes. Sputtering and Plasma Etching 1980, John Wiley and Sons, Inc.
20. Shyjumon I., Gopinadhan M., Ivanova O., Quaas M., Wulff H., Helm C.A., Hippler R. Eur. Phys. J. D 2006, 37:409.
21. Shyjumon I., Gopinadhan M., Helm C.A., Smirnov B.M., Hippler R. Thin Solid Films 2006, 500:41.
22. Ganeva M., Peter T., Bornholdt S., Kersten H., Strunskus T., Zaporojtchenko V., Faupel F., Hippler R. Contributions to Plasma Physics 2012.
23. Wolter M., Do H.T., Steffen H., Hippler R. J. Phys. D: Appl. Phys. 2005, 38:2390.
24. Kashtanov P.V., Smirnov B.M., Hippler R. Physics-Uspekhi 2007, 50:455.
25. Gencoa Ltd., Gencoa sputter rate calculator (calc.gencoa.co.uk), 2006.
26. G.B. Crumley, R.E. Demaray, 1987. European Patent EP0297779 - Magnetron sputtering targets.
27. M. Abburi, S. Ramaswami, 2002. US Patent No 6 436 207.
28. Thornton J.A. Thin Solid Films 1981, 80:1.
29. Rossnagel S.M., Kaufman H.R. J. Vac. Sci. Technol. A 1988, 6:223.
30. Peter T., Wegner M., Zaporojtchenko V., Strunskus T., Bornholdt S., Kersten H., Faupel F. Surf. Coat. Technol. 2011, 205:S38.
31. Solar P., Polonskyi O., Choukourov A., Artemenko A., Hanus J., Biederman H., Slavinska D. Surf. Coat. Technol. 2011, 205:S42.
32. Stranak V., Block S., Drache S., Hubicka Z., Helm C.A., Jastrabik L., Tichy M., Hippler R. Surf. Coat. Technol. 2011, 205:2755.
33. Marek A., Valter J., Kadlec S., Vyskocil J. Surf. Coat. Technol. 2011, 205:S573.
34. Gracia-Pinilla M., Martínez E., Vidaurri G., Pérez-Tijerina E. Nanoscale Res. Lett. 2010, 5:180.
35. Banerjee A., Krishna R., Das B. Appl. Phys. A Mater. Sci. Process. 2008, 90:299.
36. Kamalou O., Rangama J., Ramillon J.-M., Guinement P., Huber B.A. Rev. Sci. Instrum. 2008, 79:063301.
37. Smirnov B.M. Physics-Uspekhi 2011, 54:691.
38. Goeckner M.J., Goree J.A., Sheridan J., Terrence E. IEEE Trans. Plasma Sci. 1991, 19:301.
39. Matsunami N., Yamamura Y., Itikawa Y., Itoh N., Kazumata Y., Miyagawa S., Morita K., Shimizu R. Radiat. Eff. 1981, 57:15.
40. Yamamura Y., Matsunami N., Itoh N. Radiat. Eff. 1983, 71:65.
41. Eckstein W. Calculated Sputtering, Reflection and Range Values. Technical Report 9/132, IPP 2002.
42. Yamamura Y., Shindo S. Radiat. Eff. 1984, 80:57.
43. Seah M.P., Clifford C.A., Green F.M., Gilmore I.S. Surf. Interface Anal. 2005, 37:444.
44. Yamamura Y., Tawara H. At. Data Nucl. Data Tables 1996, 62:149.
45. Lindhard J., Scharff M. Phys. Rev. 1961, 124:128.
46. Ono T., Kenmotsu T., Muramoto T. volume 109 of Springer Series in Materials Science 2008, 1. Springer, Berlin Heidelberg. D. Depla, S. Mahieu (Eds.).
47. Stepanova M., Dew S.K. J. Vac. Sci. Technol. A 2001, 19:2805.
48. Fukami T., Shintani F., Naoe M. Thin Solid Films 1987, 151:373.
49. Fukami T., Sakuma T. Jpn. J. Appl. Phys. 1982, 21:1680.