Effect of adding Ce on interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu substrate

Journal of Central South University of Technology (English Edition)

Volumn 15, Issue 3, 2008, Pages 313-317

  Lu, Bin ^a   Li, Hui ^a   Wang, Juan Hui ^a   Zhu, Hua Wei ^a   Jiao, Xian He ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Interface; Intermetallic compound; Rare earth element; Sn 3.0Ag 0.5Cu solder

Indexed keywords

BRAZING; CERIUM; CERIUM COMPOUNDS; INTERMETALLICS; METALS; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERED JOINTS; SOLDERING; SOLDERING ALLOYS; TELLURIUM COMPOUNDS; TIN; TIN ALLOYS; WELDING;

CU(1 0 0) SUBSTRATES; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUND (IMC); SN-3.0 AG-0.5CU;

COPPER ALLOYS;

EID: 44949200131     PISSN: 10059784     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11771-008-0059-y     Document Type: Article

References (18)

1. KIM K S, HUH S H, SUGANUMA K. Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu [J]. Microelectronics Reliability, 2003, 43(2):259-267.
2. CHEN W T, LEE S W, YIP M C. Mechanical properties and intermetallic compound formation at the Sn/Ni and Sn-0.7wt%/Ni joints [J]. Journal of Electronic Materials, 2003, 32(11): 1284-1289.
3. YU D Q, WANG L. The growth and roughness evolution of intermetallic compounds of Sn-Ag-Cu/Cu interface during soldering reaction [J]. Journal of Alloys and Compounds, 2008, 458(4/2): 542-547.
4. GHOSH G. Interfacial microstructure and the kinetics of interfacial reaction in diffusion couples between Sn-Pb solder and Cu/Ni/Pd metallization [J]. Acta Materialia, 2000, 48(14): 3719-3738.
5. LI Xiao-yan, YAN Yong-chang, SHI Yao-wu. Influence of IMC on the interface failure of Sn-Ag-Cu/Cu solder joint [J]. Journal of Mechanical Strength, 2005, 27(5): 666-671.
6. YU D Q, WU C M L, LAW C M T, WANG L, LAI J K L. Intermetallic compounds growth between Sn-3.5Ag lead-free solder and Cu substrate by dipping method [J]. Journal of Alloys and Compounds, 2005, 392(1/2): 192-199.
7. YOON J W, KIM S W, JUNG S B. Interfacial reaction and mechanical properties of eutectic Sn-0.7Cu/Ni BGA solder joints during isothermal long-term aging [J]. Journal of Alloys and Compounds, 2005, 391(1/2): 82-89.
8. MA X, QIAN Y Y, YOSHIDA F. Effect of La on the Cu-Sn intermetallic compound (IMC) growth and solder joint reliability [J]. Journal of Alloys and Compounds, 2002, 334(1/2): 224-227.
9. WUA C M L. Properties of lead-free solder alloys with rare earth element additions [J]. Materials Science and Engineering Report, 2004, 44: 1-44.
10. YOON J W, JUNG S B. Investigation of interfacial reactions between Sn-5Bi solder and Cu substrate [J]. Journal of Alloys and Compounds, 2003, 359(1/2): 202-208.
11. YOON J W, LEE Y H, KIM D G, KANG H B, SUH S J, YANG C W, LEE C B, JUNG J W, YOO C S, JUNG S B. Intermetallic compound layer growth at the interface between Sn-Cu-Ni solder and Cu substrate [J]. Journal of Alloys and Compounds, 2004, 381(1/2):151-157.
12. HIROSHI N, JIN Y P, TADASHI T. Interfacial reaction between Su-0.7Cu(-Ni) solder and Cu substrate [J]. Journal of Electronic Materials, 2006, 35(5): 1127-1132.
13. PAKASH K H, SITHARAN T. Interface reaction between copper and molten Sn-Pn solders [J]. Acta Materialia, 2001, 49(13):2481-2489.
14. LI Bo, SHI Yao-wu, LEI Yong-ping. Effect of rare element addition on the microstructure of Sn-Ag-Cu solder joint [J]. Journal of Electronic Materials, 2006, 34(3): 217-224.
15. TU X N, THOMPSON R D. Kinetics of interfacial reaction in bimetallic Cu-Sn thin films [J]. Acta Metallurgica Materialia, 1982, 30(5): 947-952.
16. LAW C M T, WU C M L, YU D Q. Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-Re lead-free solder alloys [J]. Journal of Electronic Materials, 2006, 35(1): 89-93.
17. BO Song-bai, CHEN Yan, LÜ Xiao-chun. Thermodynamics calculation and preliminary of the Sn-Ag-Cu-Ce Lead-free solder [J]. Transactions of the China Welding Institution, 2005, 26(5): 20-22.
18. BO Song-bai, CHEN Yan, LÜ Xiao-chun. The calculation and application of activity interaction parameter in the Lead-free solder [J].Transactions of the China Welding Institution, 2005, 26(4):45-47.