A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity

Nanotechnology

Volumn 23, Issue 4, 2012, Pages

  Fu, Yifeng ^a,b   Nabiollahi, Nabi ^a   Wang, Teng ^a   Wang, Shun ^c   Hu, Zhili ^a,c   Carlberg, Björn ^a   Zhang, Yan ^c   Wang, Xiaojing ^c   Liu, Johan ^a,c,d  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b FOAB Elektronik AB   (Sweden)

^c SHANGHAI UNIVERSITY   (China)

^d SHT SMART HIGH TECH AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SURFACES; COOLING MEDIUM; COOLING SOLUTIONS; ELECTRONIC SYSTEMS; FINITE-ELEMENT METHOD MODELING; FLUID FIELD; GEOMETRICAL DESIGNS; HIGH POWER DENSITY; HOT SPOT; MACRO SCALE; MICRO COOLING; MICRO-FINS; MOLECULAR DYNAMICS SIMULATIONS; MULTI-SCALE MODELING; NANO SCALE; ON-CHIP COOLING; ORDERS-OF-MAGNITUDE; THERMAL CONTACT RESISTANCE; TRANSFER TECHNIQUE; ULTRA-THIN;

CARBON NANOTUBES; COOLING SYSTEMS; FINITE ELEMENT METHOD; HEAT SINKS; MOLECULAR DYNAMICS;

ELECTRONIC COOLING;

EID: 84862921866     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/23/4/045304     Document Type: Article

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