Development of liquid cooling techniques for flip chip ball grid array packages with high heat flux dissipations

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 1, 2005, Pages 127-135

  Zhang, Heng Yun ^a   Pinjala, D ^a   Wong, T N ^b   Joshi, Yogendra K ^c  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Analytical method; Flip chip ball grid array packages (FBGAs); Liquid cooling; Measurement; Microchannel heat sink

Indexed keywords

COOLING; FLIP CHIP DEVICES; HEAT FLUX; HEAT LOSSES; HEAT RESISTANCE; HEAT SINKS; HEAT TRANSFER; MATHEMATICAL MODELS; PRESSURE DROP;

FLIP CHIP BALL GRID ARRAY PACKAGES (FBGAS); HEAT FLUX DISSIPATION; LIQUID COOLING; MICROCHANNEL HEAT SINK;

ELECTRONICS PACKAGING;

EID: 15744394622     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.843164     Document Type: Article

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