A practical implementation of silicon microchannel coolers for high power chips

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 2, 2007, Pages 218-225

  Colgan, Evan G ^a   Furman, Bruce ^a   Gaynes, Michael ^a   Graham, William S ^a   LaBianca, Nancy C ^a   Magerlein, John H ^a   Polastre, Robert J ^a   Rothwell, Mary Beth ^a   Bezama, R J ^b   Choudhary, Rehan ^b   Marston, Kenneth C ^b   Toy, Hilton ^b   Wakil, Jamil ^b   Zitz, Jeffrey A ^b   Schmidt, Roger R ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM   (United States)

Author keywords

High power density; Liquid cooling; Microchannel cooling

Indexed keywords

COOLING; FINS (HEAT EXCHANGE); HEAT EXCHANGERS; HEAT RESISTANCE; MICROCHANNELS; PRESSURE DROP; SEMICONDUCTING SILICON;

HIGH POWER DENSITY; LIQUID COOLING; MICROCHANNEL COOLING;

MICROPROCESSOR CHIPS;

EID: 34249887919     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.897977     Document Type: Article

References (8)

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